Semiconductor device and its wiring method
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Abstract
A semiconductor device mounted on a mother board has a circuit board to be positioned on the mother board and a semiconductor chip positioned on the circuit board. The circuit board has a connection pad, a relay pad spaced away from the connection pad, and a wire connecting between the connection pad and the relay pad on a surface of the circuit board supporting the semiconductor chip. Also, the semiconductor chip has a connection pad corresponding to the connection pad formed on the circuit board. Further, the connection pad on the circuit board and the connection pad on the semiconductor chip are electrically connected to each other through a bonding wire.
22 Citations
10 Claims
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1-9. -9. (canceled)
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10. A semiconductor device, comprising:
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a circuit board having a first pad;
a first semiconductor chip mounted on a first plane surface of said circuit board and having a second pad and a connection wire electrically connected the second pad;
a second semiconductor chip mounted on a second plane surface of said first semiconductor chip so as to face a third plane surface thereof to the second plane, said second semiconductor chip having a third pad formed on the third plane surface, and a bonding wire jumping from the second pad over one edge of said first semiconductor chip and reaching the first pad, wherein the second pad is formed in an area of the second plane surface which is not covered by said second conductor chip, and the connection wire is formed in said first semiconductor chip and electronically connected to the third pad of said second semiconductor chip.
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Specification