HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES
0 Assignments
0 Petitions
Accused Products
Abstract
Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.
-
Citations
74 Claims
-
1-54. -54. (canceled)
-
55. A structure for making electrical contact to an electronic devices contact locations comprising:
-
a substrate having a first electrical contact location thereon;
a first electrical conductor having a first end in electrical contact with said first contact location and a second end extending in a substantially perpendicular direction away therefrom;
providing a second electrical conductor;
said second end of said first electrical conductor terminating at a surface of and in electrical contact with a said second electrical conductor at a first electrical contact location of said second electrical conductor;
said second electrical conductor projecting away from said first electrical conductor;
said second electrical conductor comprising a raised contact tip conductor in a substantially perpendicular direction with respect to said second electrical conductor forming a cantilevered electrical contact structure end in electrical contact with said second electrical conductor, said raised contact tip end is adapted for electrically contacting said electronic device contact locations;
said second electrically conductive beam has a bottom surface at least a portion of which is disposed facing as spaced apart from said substrate. - View Dependent Claims (57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74)
-
-
56. (canceled)
Specification