HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES
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Accused Products
Abstract
Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.
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Citations
67 Claims
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1-55. -55. (canceled)
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56. A high density probe for making electrical contact with a plurality of raised, flat or recessed contacts on an integrated circuit device comprising:
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a first substrate having a first surface;
said first surface having a plurality of contact locations;
a plurality of first short studs extending outward from said contact locations, away from said first surface on said substrate;
a plurality of flexible electrically conductive beams having a plurality of electrical contact locations corresponding to said plurality of said first short studs;
said plurality of flexible electrically conductive beams project from said contact location on said second electrical conductor as a cantilevered electrically conductive beam substantially parallel to said first surface of said substrate;
a raised tip end on a surface of said plurality of flexible electrically conductive beams;
said plurality of electrically conductive beams have a bottom surface at least a portion of which is disposed facing and spread apart from said substrate. - View Dependent Claims (57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67)
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Specification