Computer casing with high heat dissipation efficiency

• US 20080024985A1
• Filed: 07/31/2006
• Published: 01/31/2008
• Est. Priority Date: 07/31/2006
• Status: Abandoned Application

• Current Assignee: Macs Technology Inc. (Micro-Star International Co., Ltd.)
• Original Assignee: Macs Technology Inc. (Micro-Star International Co., Ltd.)
• Inventors: Chang, Zhong-Yang, Lee, Zong-Jui
• Application Number:
  US11/495,699
• Publication Number:
  US 20080024985A1
• Time in Patent Office: Days
• US Class Current: 361/695
• CPC Class Codes: G06F 1/181 Enclosures for portable computers G06F1/1613
• CPC Class Codes: G06F 1/20 Cooling means

Abstract

A computer casing with high heat dissipation efficiency comprises a lateral plate at an outer side of the supporting seat; a fan installed on the lateral plate; a supporting seat installed at an inner side of the lateral plate; a mother board installed to have a predetermined space to the supporting seat; a processing unit of a computer on the mother board; and a flow guide plate installed between the lateral plate and the flow guide plate; the flow guide plate being formed with a plurality of through holes at positions corresponding to those of the fan for sucking air to the fan; the flow guide plate having a plurality of ribs at an outer side thereof; the ribs being formed as flow channels for guiding air in the computer casing to the fan. The flow guide plate has a plurality of via holes which are arranged randomly on the flow guide plate; and edges of the flow guide plate have a plurality of edge holes.

Claims

1. A computer casing with high heat dissipation efficiency, comprising:

a lateral plate at an outer side of the supporting seat;

a fan installed on the lateral plate;

a supporting seat installed at an inner side of the lateral plate;

a mother board installed to have a predetermined space to the supporting seat;

a processing unit of a computer on the mother board; and

a flow guide plate installed between the lateral plate and the flow guide plate;

the flow guide plate being formed with a plurality of through holes at positions corresponding to those of the fan for sucking air to the fan;

the flow guide plate having a plurality of ribs at an outer side thereof;

the ribs being formed as flow channels for guiding air in the computer casing to the fan.

2. The computer casing with high heat dissipation efficiency as claimed in claim 1, wherein the flow guide plate has a plurality of via holes which are arranged randomly on the flow guide plate;

and edges of the flow guide plate have a plurality of edge holes.

3. The computer casing with high heat dissipation efficiency as claimed in claim 1, wherein the supporting seat has a plurality of through holes corresponding to the through holes of the flow guide plate, via holes randomly formed on the supporting seat and edge holes near the edges thereof.

4. The computer casing with high heat dissipation efficiency as claimed in claim 1, wherein the lateral plate is installed at a frame body of the computer casing for installing the fan to such air in the computer casing.

5. The computer casing with high heat dissipation efficiency as claimed in claim 1, wherein the computer casing is one of a casing of a personal computer, a casing of a servo computer and a casing an industry computer.

6. The computer casing with high heat dissipation efficiency as claimed in claim 1, wherein the through holes of the flow guide plate are arranged as a swirl shape and the ribs of the flow guide plate are arranged as a swirl shape lead to the through holes of the flow guide plate.