Method of depositing a multilayer coating with a variety of oxide adhesion layers and organic layers

• US 20080026146A1
• Filed: 09/28/2007
• Published: 01/31/2008
• Est. Priority Date: 06/04/2004
• Status: Abandoned Application

• Current Assignee: Applied Microstructures, Inc. (KLA Corporation)
• Original Assignee: Applied Microstructures, Inc. (KLA Corporation)
• Inventors: Nowak, Romuald, Kobrin, Boris, Yi, Richard, Chinn, Jeffrey
• Application Number:
  US11/906,071
• Publication Number:
  US 20080026146A1
• Time in Patent Office: Days
• US Class Current: 427/255.6
• CPC Class Codes: B05D 1/185 applying monomolecular layers B05D1/204 takes precedence
• CPC Class Codes: B05D 1/60 Deposition of organic layers from vapour phase vapour phase deposition in general C23C14/00, C23C16/00
• CPC Class Codes: B05D 3/142 Pretreatment
• CPC Class Codes: B05D 3/145 After-treatment
• CPC Class Codes: B05D 7/52 Two layers
• CPC Class Codes: B05D 7/56 Three layers or more
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: C03C 17/42 at least one coating of an organic material and at least one non-metal coating
• CPC Class Codes: C03C 23/006 by plasma or corona discharge
• CPC Class Codes: C23C 16/0227 by cleaning or etching
• CPC Class Codes: C23C 16/0245 by etching with a plasma
• CPC Class Codes: C23C 16/0272 Deposition of sub-layers, e.g. to promote the adhesion of the main coating
• CPC Class Codes: C23C 16/401 containing silicon
• CPC Class Codes: C23C 16/402 Silicon dioxide
• CPC Class Codes: C23C 16/448 characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
• CPC Class Codes: C23C 16/4485 by evaporation without using carrier gas in contact with the source material C23C16/4486 takes precedence
• CPC Class Codes: C23C 16/455 characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
• CPC Class Codes: C23C 16/45557 Pulsed pressure or control pressure
• CPC Class Codes: C23C 16/56 After-treatment
• CPC Class Codes: Y10T 428/12618 : Plural oxides
• CPC Class Codes: Y10T 428/12632 : Four or more distinct components with alternate recurrence of each type component
• CPC Class Codes: Y10T 428/24 : Structurally defined web or sheet [e.g., overall dimension, etc.]
• CPC Class Codes: Y10T 428/24355 : Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
• CPC Class Codes: Y10T 428/24967 : Absolute thicknesses specified
• CPC Class Codes: Y10T 428/24975 : No layer or component greater than 5 mils thick
• CPC Class Codes: Y10T 428/261 : In terms of molecular thickness or light wave length
• CPC Class Codes: Y10T 428/265 : 1 mil or less
• CPC Class Codes: Y10T 428/31663 : As siloxane, silicone or silane
• CPC Class Codes: Y10T 428/31667 : Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product

Abstract

An improved vapor-phase deposition method and apparatus for the application of multilayered films/coatings on substrates is described. The method is used to deposit multilayered coatings where the thickness of an oxide-based layer in direct contact with a substrate is controlled as a function of the chemical composition of the substrate, whereby a subsequently deposited layer bonds better to the oxide-based layer. The improved method is used to deposit multilayered coatings where an oxide-based layer is deposited directly over a substrate and a SAM organic-based is directly deposited over the oxide-based layer. Typically a series of alternating layers of oxide-based layer and organic-based layer are applied.

Claims

1. A method of depositing multilayered coatings on a substrate, which coatings are tailored to provide a particular characteristic behavior, wherein all layers of said multilayered coating are deposited from a vapor phase, and wherein said multilayered coatings include at least one oxide-based layer and at least one organic-based layer.

2. A method in accordance with claim 1, wherein a plurality of oxide based layers are deposited.

3. A method in accordance with claim 1, wherein said vapor phase deposition employs a stagnant source of reactive moities during the formation of each layer of the coating, which source of reactive moities is depleted as the layer deposition continues.

4. A method in accordance with claim 1 or claim 3, wherein said method is carried out using a stepped addition of reactive moities to be consumed during deposition of a coating layer.

6. A method in accordance with claim 1 or claim 3, wherein a plasma treatment is carried out after the deposition of each organic-based layer which is not the final surface layer of the coating.

7. A method in accordance with claim 1 or claim 3, wherein said plurality of oxide-based layers and organic-based layers are deposited so that an oxide-based layer alternates with an organic-based layer.

8. A method in accordance with claim 1 or claim 3, wherein prior to deposition of a first organic-based layer on a substrate, an oxide-based layer is applied over said substrate.

12. A method in accordance with claim 8, wherein prior to deposition of said oxide-based layer, said substrate is treated using an oxygen-based plasma.

17. A method in accordance with claim 8, wherein said oxide-based layer is formed by a reaction between chlorosilane vapor and water vapor, and wherein a combination of a partial pressure of said chlorosilane vaporous precursor and a partial pressure of said water vapor precursor are used to control said reaction between said chlorosilane precursor and said water precursor.

23. A method in accordance with claim 17, wherein, subsequent to the deposition of said oxide and subsequent to the creation of hydroxyl groups on said oxide surface, a vaporous organo-chlorosilane which includes a specific functional group is reacted with said hydroxyl groups to impart specific functional characteristics to said coating.

24. A method in accordance with claim 23, wherein a partial pressure of said organo-chlorosilane vaporous precursor is used to control said reaction between said organo-chlorosilane precursor and said hydroxyl groups so that said reaction occurs substantially on said substrate surface.

26. A method in accordance with claim 23 wherein said organo-silane vaporous precursor includes a functional moiety selected from the group consisting of an alkyl group, an alkoxyl group, an alkyl substituted group containing fluorine, an alkoxyl substituted group containing fluorine, a vinyl group, an ethynyl group, an epoxy group, a glycoxy group, an acrylo group, a glycol substituted group containing a silicon atom or an oxygen atom, and combinations thereof.

5. (canceled)

9-11. -11. (canceled)

13-16. -16. (canceled)

18-22. -22. (canceled)

25. (canceled)

27-30. -30. (canceled)

31. A method of depositing a multilayered coating on a substrate from a vapor phase, wherein each layer deposition rate and a surface roughness of said multilayered coating are simultaneously controlled by controlling a total pressure in a processing chamber in which said coating is deposited, a partial pressure of at least one coating precursor, a temperature of a substrate on which said coating is deposited, and at least one temperature of a major processing apparatus surface inside said processing chamber.

32. A method of controlling the surface roughness of a multilayered organo-silicon-containing coating on a substrate, wherein said multilayered coating is deposited from a vapor phase, wherein at least one layer is formed using an organosilane precursor which is introduced into a coating deposition chamber in which said multilayered coating is deposited, followed by the introduction of water vapor, and wherein said surface roughness of said at least one layer is further controlled by controlling a total pressure in said deposition chamber, a partial pressure of at least one precursor, and a temperature of a substrate on which said coating is deposited.

33. A method in accordance with claim 32, wherein at least two organosilane precursors are introduced into said coating deposition chamber, followed by the introduction of water, whereby controllable co-deposition of said organosilane precursors is obtained.

34. A method in accordance with claim 32, where a partial pressure of each precursor is controlled to adjust said surface roughness of said organo-silicon-containing coating.

35. A method in accordance with claim 32, wherein a partial pressure of said water vapor precursor is controlled to adjust said surface roughness of said organo-silicon-containing coating.

36. A method of depositing a multilayered coating wherein an oxide-based layer thickness in direct contact with a substrate is controlled as a function of the chemical composition of said substrate, and wherein a SAM organic-based layer is deposited directly over said oxide-based layer, whereby an ability of said SAM organic-based layer to bond to said oxide-based layer is improved due to control of said oxide-based layer thickness.

46. A method in accordance with claim 36, wherein a plurality of oxide layers are applied to achieve a nominal oxide-based layer thickness prior to the application of a SAM organic-based layer.

47. A method in accordance with claim 36, wherein said oxide-based layer is comprised of an oxide selected from the group consisting of silicon oxide, aluminum oxide, zirconium oxide, titanium oxide, nickel oxide, tin oxide, and combinations thereof.

48. A method in accordance with claim 47, wherein said oxide-based layer is selected from the group consisting of silicon oxide, aluminum oxide, titanium oxide, and combinations thereof.

37. A method of depositing a multilayered coating over a substrate, comprising deposition of at least two oxide-based layers and at least one organic-based layer, where each layer is deposited from a vapor phase, wherein said oxide based layer and said organic-based layer are alternated, and wherein an oxide-based layer is deposited directly over a surface of said substrate.

38-45. -45. (canceled)