COMPUTER COOLER

• US 20080028767A1
• Filed: 08/01/2006
• Published: 02/07/2008
• Est. Priority Date: 08/01/2006
• Status: Abandoned Application

• Current Assignee: Lionel H. Broderick
• Original Assignee: Lionel H. Broderick
• Inventors: Broderick, Lionel H.
• Application Number:
  US11/461,686
• Publication Number:
  US 20080028767A1
• Time in Patent Office: Days
• US Class Current: 62/3.2
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 1/206 comprising thermal management

Abstract

The invention is a solid-state thermoelectric cooling device for attachment to a personal or laptop computer. The device consists of a plurality of thermoelectric coolers that are mounted on a heat exchanger, each powered by less than about 12 volts DC, which provides a cold face on a thermoelectric cooling panel which is mounted on the top or a side of the computer. The internal temperature of the computer is controlled to avoid moisture condensation.

Claims

1. A structure, comprising:

a cooling panel that is adaptable to attach to a personal computer case;

said cooling panel comprised of a plurality of solid-state thermoelectric coolers;

said thermoelectric coolers powered by less than about 12 volts of direct current;

said thermoelectric coolers attached to insulated wires which are connected in parallel; and

said thermoelectric coolers mounted on a heat exchanger.

2. The structure according to claim 1, wherein said heat exchanger is comprised of copper.

3. The structure according to claim 1, wherein thermally conductive epoxy attaches said cooling panel to the computer case.

4. The structure according to claim 1, wherein said cooling panel is attached to the computer case with bolts.

5. The structure according to claim 1, wherein said cooling panel is comprised of thermoelectric coolers located between a cold plate that radiates heat to the surroundings and a heatsink that contacts the computer case.

6. A method of cooling a computer, comprising the steps of:

providing a computer having a case;

selecting a thermoelectric cooling panel;

attaching the thermoelectric cooling panel with bolts to the computer case;

sealing the computer case to prevent air leakage;

monitoring ambient and dew point temperatures inside the computer case;

maintaining the temperature of the thermoelectric cooling panel above the dew point temperature; and

turning the computer off if the ambient temperature exceeds a set point value.