SUBSTRATE SUPPORT WITH PROTECTIVE LAYER FOR PLASMA RESISTANCE

• US 20080029032A1
• Filed: 08/01/2006
• Published: 02/07/2008
• Est. Priority Date: 08/01/2006
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Sun, Jennifer Y., Chou, Irene A.
• Application Number:
  US11/461,643
• Publication Number:
  US 20080029032A1
• Time in Patent Office: Days
• US Class Current: 118/728
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H01L 21/68757 characterised by a coating or a hardness or a material
• CPC Class Codes: H02N 13/00 Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Abstract

Embodiments of the present invention provide a substrate support assembly having a protective layer that enhances plasma resistance. In one embodiment, a substrate support assembly includes an electrostatic chuck having an upper substrate support surface, and a protective layer disposed on the electrostatic chuck, wherein the protective layer is fabricated by a ceramic material containing a rare earth metal.

Claims

1. A substrate support assembly, comprising:

an electrostatic chuck having an upper substrate support surface;

a protective layer disposed on the electrostatic chuck, wherein the protective layer includes a ceramic material containing a rare earth metal.

2. The substrate support assembly of claim 1, wherein the protective layer comprises yttrium.

3. The substrate support assembly of claim 1, wherein the protective layer comprises Y₂O₃.

4. The substrate support assembly of claim 1, wherein the rare earth metal further comprises at least one of scandium (Sc) or cerium (Ce).

5. The substrate support assembly of claim 1, wherein the rare earth metal further comprises an oxide of rare earth metal.

6. The substrate support assembly of claim 1, wherein the protective layer comprises yttrium-aluminum-garnet (YAG).

7. The substrate support assembly of claim 1, wherein the protective layer comprises a bulk yttrium layer.

8. The substrate support assembly of claim 1, wherein the protective layer comprises Y₂O₃ mixed in a metal.

9. The substrate support assembly of claim 8, wherein the metal having Y₂O₃ mixed therein is at least one of aluminum (Al), magnesium (Mg), titanium (Ti), tantalum (Ta).

10. The substrate support assembly of claim 1, wherein the protective layer comprises doped Y₂O₃.

11. The substrate support assembly of claim 1, wherein the substrate support assembly further comprises:

a base having at least one cooling channel disposed therein; and

a metal containing adhesive coupling the base to a lower surface of an ceramic puck in the electrostatic chuck.

12. The substrate support assembly of claim 11, wherein the ceramic puck is fabricated by at least one of aluminum oxide (Al₂O₃), aluminum nitride (AlN), titanium oxide (TiO), titanium nitride (TiN), silicon carbide (SiC), and a ceramic material containing rare earth metal.

13. The substrate support assembly of claim 12, wherein the rare earth metal of the ceramic material utilized for ceramic puck is Y₂O₃.

14. The substrate support assembly of claim 1, wherein the protective layer has a thickness between about 1 μ

m and about 500 μ

m.

15. The substrate support assembly of claim 1, wherein the protective layer has a density greater than about 4.3.

16. The substrate support assembly of claim 1, wherein the protective layer is a ceramic material having a surface roughness between about 2 μ

-inch and 400 μ

-inch, such as about 16 μ

-inch.

17. The substrate support assembly of claim 1, wherein the protective layer is a yttrium oxide layer (Y₂O₃) having a purity at least about 99.9 percent by volume.

18. A substrate support assembly, comprising:

an electrostatic chuck including a ceramic puck having an upper surface adapted to support a substrate disposed thereon;

a base attached to a lower surface of the ceramic puck, the base having at least one fluid conduit formed therein and adapted to control the lateral temperature profile of the electrostatic puck; and

a protective layer disposed on the ceramic puck, wherein the protective coating is a ceramic material containing a rare earth metal.

19. The substrate support assembly of claim 18, wherein the protective layer comprises at least one of yttrium, Y₂O₃ or yttrium-aluminum-garnet (YAG).

20. The substrate support assembly of claim 18, wherein the rare earth metal further comprises at least one of scandium (Sc) or cerium (Ce).

21. The substrate support assembly of claim 18, wherein the rare earth metal further comprises an oxide of rare earth metal.

22. The substrate support assembly of claim 18, wherein the protective layer comprises Y₂O₃ mixed in a metal, wherein the metal is at least one of aluminum (Al), magnesium (Mg), titanium (Ti), tantalum (Ta).

23. The substrate support assembly of claim 18, wherein the ceramic puck is fabricated by at least one of aluminum oxide (Al₂O₃), aluminum nitride (AlN), titanium oxide (TiO), titanium nitride (TiN), silicon carbide (SiC), and a ceramic material containing rare earth metal.

24. The substrate support assembly of claim 18 further comprising:

a bonding material coupling the ceramic puck to the base, wherein the bonding material is at least one of an acrylic based compound and silicon based compound.

25. A substrate support assembly, comprising:

a ceramic puck;

a base attached to a lower surface of the ceramic puck, the base having at least one fluid conduit formed therein and adapted to control the lateral temperature profile of the ceramic puck;

an adhesive coupling the base to a lower surface of the puck;

metal fillers disposed in the adhesive, the metal fillers comprising at least one of Al, Mg, Ta, Ti; and

a protective Y₂O₃ coating coated on the upper surface of the ceramic puck.

26. The substrate support assembly of claim 25, wherein the protective Y₂O₃ coating is intermixed with has a metal, wherein the metal is at least one of aluminum (Al), magnesium (Mg), titanium (Ti), tantalum (Ta).

27. The substrate support assembly of claim 25, wherein the ceramic puck is fabricated by at least one of aluminum oxide (Al₂O₃), aluminum nitride (AlN), titanium oxide (TiO), titanium nitride (TiN), silicon carbide (SiC), and a ceramic material containing rare earth metal.