Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
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Abstract
An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes.
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Citations
26 Claims
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1-20. -20. (canceled)
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21. A method comprising:
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forming a plurality of conductive planes;
forming a plurality of dielectric layers separating said plurality of conductive planes; and
forming a conductive groove connecting more than two of said plurality of conductive planes.
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22. The method of claim 27 wherein said groove is formed in a ā
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shape.
- Vā
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23. The method of claim 27 wherein said conductive groove is formed using a laser.
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24. The method of claim 27 further comprising:
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segmenting at least one of said plurality of conductive planes into a plurality of portions; and
connecting at least one of said plurality of portions to at least one of said plurality of conductive planes with said conductive groove.
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25. The method of claim 27 wherein the groove is formed using a die.
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26. The method of claim 28 further comprising:
adjusting said cross-sectional area of said conductive groove.
Specification