Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery

• US 20080029296A1
• Filed: 08/10/2007
• Published: 02/07/2008
• Est. Priority Date: 02/04/2002
• Status: Active Grant

• Current Assignee: Daryl Sato, Gary Brist, Gary Long
• Original Assignee: Daryl Sato, Gary Brist, Gary Long
• Inventors: Long, Gary, Sato, Daryl, Brist, Gary
• Granted Patent: US 8,056,221 B2
• Time in Patent Office: Days
• US Class Current: 174/262
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 1/0219 Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• CPC Class Codes: H05K 1/0221 Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
• CPC Class Codes: H05K 1/0265 characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
• CPC Class Codes: H05K 2201/09036 Recesses or grooves in insulating substrate
• CPC Class Codes: H05K 2201/09509 Blind vias, i.e. vias having one side closed
• CPC Class Codes: H05K 2201/09518 Deep blind vias, i.e. blind vias connecting the surface circuit to circuit layers deeper than the first buried circuit layer
• CPC Class Codes: H05K 2201/09981 Metallised walls
• CPC Class Codes: H05K 2203/0108 Male die used for patterning, punching or transferring
• CPC Class Codes: H05K 2203/1189 Pressing leads, bumps or a die through an insulating layer
• CPC Class Codes: H05K 3/005 Punching of holes
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49156 with selective destruction of conductive paths
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49167 with deforming of conductive path

Abstract

An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes.

Claims

1-20. -20. (canceled)

21. A method comprising:

forming a plurality of conductive planes;

forming a plurality of dielectric layers separating said plurality of conductive planes; and

forming a conductive groove connecting more than two of said plurality of conductive planes.

22. The method of claim 27 wherein said groove is formed in a “

V”

shape.

23. The method of claim 27 wherein said conductive groove is formed using a laser.

24. The method of claim 27 further comprising:

segmenting at least one of said plurality of conductive planes into a plurality of portions; and

connecting at least one of said plurality of portions to at least one of said plurality of conductive planes with said conductive groove.

25. The method of claim 27 wherein the groove is formed using a die.

26. The method of claim 28 further comprising:

adjusting said cross-sectional area of said conductive groove.