In-situ process diagnostics of in-film aluminum during plasma deposition

• US 20080029484A1
• Filed: 07/25/2006
• Published: 02/07/2008
• Est. Priority Date: 07/25/2006
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Mungekar, Hemant P., Lee, Young S., Park, Soonam, Ahmad, Farhan
• Application Number:
  US11/492,639
• Publication Number:
  US 20080029484A1
• Time in Patent Office: Days
• US Class Current: 216/67
• CPC Class Codes: C23C 16/4401 Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
• CPC Class Codes: C23C 16/52 Controlling or regulating the coating process C23C16/45557, C23C16/279 take precedence
• CPC Class Codes: H01J 37/32935 Monitoring and controlling tubes by information coming from the object and/or discharge
• CPC Class Codes: H01J 37/32972 Spectral analysis

Abstract

The concentration of various contaminants in a plasma can be monitored during processing of a substrate such as a silicon wafer, in order to prevent an unacceptable amount of contamination from being deposited on the substrate. The radiation emitted from the plasma through a window in the processing chamber during processing can be detected and measured by a tool such as an optical emission spectrograph (OES) and the relative intensity of peaks in the spectrum corresponding to various contaminants can be analyzed in order to determine contaminant concentration. In one embodiment, the concentration of aluminum in a plasma is monitored during a plasma chemical vapor deposition (CVD) process in order to ensure that the amount of aluminum in the produced device is lower than a maximum threshold amount.

Claims

1. A substrate processing system, comprising:

a housing defining a process chamber, the process chamber including a substrate holder for supporting a substrate in the process chamber and a window for viewing the substrate during processing of the substrate in the process chamber;

a plasma generating system operatively coupled to the process chamber and configured to generate a plasma in the process chamber in order to process the substrate; and

an analytical tool positioned outside the process chamber and relative to the window whereby the analytical tool is operable to receive radiation emitted by the plasma during processing of the substrate, the analytical tool being further operable to measure at least a portion of the radiation corresponding to a contaminant in the plasma during processing.

2. A system according to claim 1, wherein:

the analytical tool is operable to measure the relative intensity of an emission spectrum of the plasma as a function of wavelength.

3. A system according to claim 1, wherein:

the analytical tool is an optical emission spectrograph (OES).

4. A system according to claim 1, further comprising:

a processing device operable to receive the measure of at least a portion of the radiation from the analytical tool and determine a relative concentration of the contaminant in the plasma.

5. A system according to claim 1, further comprising:

a gas-delivery system configured to introduce gases into the process chamber; and

a pressure-control system for maintaining a selected pressure within the process chamber during processing.

6. A system according to claim 1, further comprising:

a controller for control the processing of the substrate in the process chamber.

7. A system according to claim 6, wherein processing includes one of depositing a material on, and etching material from, the substrate.

8. A system according to claim 1, wherein the substrate includes a silicon wafer.

9. A system according to claim 1, wherein:

the contaminant is at least one of aluminum and an aluminum-containing compound.

10. A method of processing a substrate, comprising:

placing a substrate in a process chamber;

generating a plasma in a process chamber in order to process the substrate; and

measuring at least a portion of radiation emitted by the plasma during processing of the substrate, the portion corresponding to a contaminant in the plasma during processing.

11. A method according to claim 10, further comprising:

analyzing the measured portion of the radiation to determine a relative concentration of the contaminant in the plasma.

12. A method according to claim 11, wherein:

analyzing the measured portion includes determining a relative intensity of an emission spectrum of the plasma as a function of wavelength.

13. A method according to claim 11, further comprising:

setting a maximum contaminant threshold value for the plasma.

14. A method according to claim 13, further comprising:

determining whether the relative concentration of the contaminant is at or near the maximum contaminant threshold.

15. A method according to claim 13, further comprising:

determining whether to process another substrate in the process chamber based on whether the relative concentration of the contaminant is at or near the maximum contaminant threshold.

16. A method according to claim 15, further comprising:

treating the process chamber to reduce the amount of contaminant in the plasma when the relative concentration of the contaminant is at or near the maximum contaminant threshold.

17. A method according to claim 16, wherein:

treating the process chamber includes seasoning at least a portion of the process chamber with a layer of material.

18. A method according to claim 17, further comprising:

processing a number of test substrates after seasoning the process chamber in order to remove any contamination due to the seasoning.

19. A method according to claim 17, wherein:

the layer of material includes silicon oxide.

20. A method according to claim 11, wherein:

the contaminant is at least one of aluminum and an aluminum-containing compound.

21. A method according to claim 11, further comprising:

flowing a process gas comprising a plurality of precursor gases suitable for forming the plasma into the process chamber.

22. A method according to claim 11, further comprising:

processing the substrate.

23. A method according to claim 22, wherein:

processing the substrate includes one of depositing a material on, and etching material from, the substrate.

24. A computer program product embedded in a computer-readable storage medium, comprising:

computer program code for receiving spectral data corresponding to the optical emission of a plasma during processing of a substrate; and

computer program code for analyzing at least a portion of the spectral data to determine a relative concentration of at least one contaminant in the plasma.

25. A computer program product according to claim 24, further comprising:

computer program code for comparing the relative concentration of at least one contaminant in the plasma to a maximum concentration threshold for each determined contaminant.

26. A computer program product according to claim 24, further comprising:

computer program code for indicating to an operator when the relative concentration of at least one contaminant in the plasma is at or near a maximum concentration threshold for each determined contaminant.