LED module and method of manufacturing the same

• US 20080029778A1
• Filed: 06/05/2007
• Published: 02/07/2008
• Est. Priority Date: 08/04/2006
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Hyung-kun, Kim, Yu-sik, Cho, Jae-hee
• Application Number:
  US11/806,906
• Publication Number:
  US 20080029778A1
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material

Abstract

Provided are a light emitting diode (LED) module and a method of manufacturing the same. The LED module may include a package housing including an inner space, a light-emitting chip in the inner space of the package housing, a phosphor layer including a fluorescent material and converting light emitted from the light-emitting chip to light having a longer wavelength than that of the light emitted from the light-emitting chip. The concentration of the fluorescent material of the phosphor layer may be inhomogeneous. The method of manufacturing the LED module may include providing or forming a package housing having an inner space and including a light-emitting chip in the inner space, measuring a radiation pattern of light emitted from the light-emitting chip, and forming a phosphor layer including a fluorescent material on the light-emitting chip and having characteristics that may be determined according to the radiation pattern.

Claims

1. A light emitting diode (LED) module comprising:

a package housing including an inner space;

a light-emitting chip in the inner space of the package housing; and

a phosphor layer including a fluorescent material and converting light emitted from the light-emitting chip to light having a longer wavelength than that of the light emitted from the light-emitting chip, wherein the concentration of the fluorescent material of the phosphor layer is inhomogeneous.

2. The LED module of claim 1, wherein the concentration of the fluorescent material of the phosphor layer is determined according to a radiation pattern of the light emitted from the light-emitting chip.

3. The LED module of claim 2, wherein the concentration of the fluorescent material of the phosphor layer is greater in the portions of the phosphor layer having a higher intensity of radiation than the portions of the phosphor layer having a lower intensity of radiation.

4. The LED module of claim 1, wherein the thickness of the phosphor layer is non-uniform.

5. The LED module of claim 4, wherein the thickness of the phosphor layer is determined according to the radiation pattern of the light emitted from the light-emitting chip.

6. The LED module of claim 5, wherein the portions of the phosphor layer having a higher intensity of radiation are thicker than the portions of the phosphor layer having a lower intensity of radiation.

7. A method of manufacturing a LED module, comprising:

providing a package housing having an inner space and including a light-emitting chip in the inner space;

measuring a radiation pattern of light emitted from the light-emitting chip in the inner space of the package housing; and

forming a phosphor layer including a fluorescent material on the light-emitting chip, wherein a characteristic of the phosphor layer including the fluorescent material is determined according to the radiation pattern.

8. The method of claim 7, wherein the thickness of the phosphor layer including the fluorescent material is the characteristic being determined such that the portions of the phosphor layer having a higher intensity of radiation are thicker than the portions of the phosphor layer having a lower intensity of radiation.

9. The method of claim 8, wherein luminous efficiency or phosphor conversion efficiency (PCE) is measured according to the thickness of the phosphor layer with respect to the light-emitting chip in the inner space of the package housing.

10. The method of claim 9, wherein the greater the luminous efficiency or the PCE is, the thicker the phosphor layer is.

11. The method of claim 8, wherein the thickness of the phosphor layer is non-uniform.

12. The method of claim 7, wherein the concentration of the fluorescent material of the phosphor layer is the characteristic being determined such that the concentration of the fluorescent material of the phosphor layer is greater in the portions of the phosphor layer having a higher intensity of radiation than the portions of the phosphor layer having a lower intensity of radiation.

13. The method of claim 12, wherein luminous efficiency or PCE is measured according to the concentration of the fluorescent material of the phosphor layer with respect to the light-emitting chip in the inner space of the package housing.

14. The method of claim 13, wherein the greater the concentration of the fluorescent material of the phosphor layer is, the greater the luminous efficiency or the PCE is.