Versatile Si-based packaging with integrated passive components for mmWave applications
First Claim
1. An apparatus comprising:
- an interposer comprising a substrate having an upper and lower surface, said upper surface having at least one cavity for forming a portion of an antenna structure, said interposer including conducting through vias from said upper surface to said lower surface, said conducting through vias at said lower surface adapted for coupling to a source of electrical signals and a voltage supply,a top Si part having interconnection wiring on a lower surface and having first pads for electrically mounting an integrated circuit chip thereon,said top Si part having second pads on said lower surface mating with a plurality of conducting through vias at said upper surface of said interposer, and having an antenna positioned over said cavity for forming said antenna structure at times said top Si part is mated with said interposer.
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Abstract
An apparatus is described incorporating an interposer having a cavity for a portion of an antenna structure, having conductor through vias, a top Si part having interconnection wiring and having pads for electrically mounting an integrated circuit chip thereon, wherein the top Si part mates with the interposer electrically and mechanically. The interposer and top Si part may be scaled to provide an array of functional units. The invention overcomes the problem of combining a high efficient antenna with integrated circuit chips in a Si package with signal frequencies from 1 to 100 GHz and the problem of shielding components proximate to the antenna and reduces strain arising from mismatching of TCEs.
114 Citations
20 Claims
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1. An apparatus comprising:
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an interposer comprising a substrate having an upper and lower surface, said upper surface having at least one cavity for forming a portion of an antenna structure, said interposer including conducting through vias from said upper surface to said lower surface, said conducting through vias at said lower surface adapted for coupling to a source of electrical signals and a voltage supply, a top Si part having interconnection wiring on a lower surface and having first pads for electrically mounting an integrated circuit chip thereon, said top Si part having second pads on said lower surface mating with a plurality of conducting through vias at said upper surface of said interposer, and having an antenna positioned over said cavity for forming said antenna structure at times said top Si part is mated with said interposer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification