Apparatus for reducing contaminants from a chemical mechanical polishing pad

• US 20080032609A1
• Filed: 02/13/2007
• Published: 02/07/2008
• Est. Priority Date: 03/08/2006
• Status: Abandoned Application

• Current Assignee: Jeffrey H. Benedict
• Original Assignee: Jeffrey H. Benedict
• Inventors: Benedict, Jeffrey H.
• Application Number:
  US11/674,286
• Publication Number:
  US 20080032609A1
• Time in Patent Office: Days
• US Class Current: 451/56
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Abstract

The present invention provides an apparatus for reducing contaminants on an unused chemical mechanical polishing pad. The apparatus comprises a rotating vacuum platen for rotating and holding the polishing pad, a traversing arm that moves between a peripheral edge and a center axis of the polishing pad, and a contaminant collection nozzle movably disposed along a length of the traveling arm for collecting contaminants from the polishing pad. Further, the apparatus comprises a vacuum pump for providing a vacuum to the rotating vacuum platen and the contaminant collection nozzle.

Claims

1. A method for expelling and collecting debris from a surface of a chemical mechanical polishing pad, comprising:

introducing debris to the surface of the chemical mechanical polishing pad during manufacture;

providing an air blast nozzle;

providing a contaminant collection nozzle;

expelling the debris from the surface of the chemical mechanical polishing pad;

wherein the air blast nozzle and the contaminant collection nozzle work in conjunction to expel and collect the debris.

2. The method of claim 1, wherein the debris are introduced to the polishing pad during manufacture of the polishing pad.

3. The method of claim 1, wherein the debris are introduced to the polishing pad during grooving of the polishing pad.

4. The method of claim 1, wherein the air blast nozzle delivers air at a pressure between 35 and 620 kPa.

5. The method of claim 1, wherein the contaminant collection nozzle collects debris with a vacuum of between 3.7 to 4.7 kPa.

6. The method of claim 1, further comprising:

providing a vacuum platen;

holding the chemical mechanical polishing pad on the vacuum platen with vacuum;

rotating the vacuum platen and the chemical mechanical polishing pad; and

,

sweeping the air blast nozzle and contaminant collection nozzle from a center of the chemical mechanical polishing pad to a peripheral edge of the chemical mechanical polishing pad.

7. The method of claim 6, wherein the debris are introduced to the polishing pad during manufacture of the polishing pad.

8. The method of claim 6, wherein the debris are introduced to the polishing pad during grooving of the polishing pad.

9. The method of claim 6, wherein the vacuum platen is rotated at a speed between 150 and 850 rpm.

10. The method of claim 1, wherein the air blast nozzle delivers air at a pressure between 35 and 620 kPa;

and, wherein the contaminant collection nozzle collects debris with a vacuum of between 3.7 to 4.7 kPa.