Light-Emitting Device, Light-Emitting Module, Display Unit, Lighting Unit and Method for Manufacturing Light-Emitting Device

• US 20080036362A1
• Filed: 11/10/2005
• Published: 02/14/2008
• Est. Priority Date: 11/22/2004
• Status: Abandoned Application

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Nagai, Hideo, Tanimoto, Noriyasu, Obara, Kunihiko
• Application Number:
  US11/571,550
• Publication Number:
  US 20080036362A1
• Time in Patent Office: Days
• US Class Current: 313/498
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/12035 Zener diode
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/351 Thermal stress
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/486 : adapted for surface mounting
• CPC Class Codes: H01L 33/508 : having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light-emitting device (1) includes the following: a substrate (10) that includes a base material (11) and a first conductor pattern (12) formed on a principal surface (11a) of the base material (11); a semiconductor light-emitting element (14) that is mounted on the first conductor pattern (12); and a phosphor layer (15) that is formed on the substrate (10) to cover the semiconductor light-emitting element (14) and emits fluorescence as a result of absorption of light emitted from the semiconductor light-emitting element (14). A side (15a) of the phosphor layer (15) and a side (10a) of the substrate (10) are connected continuously. The light-emitting device (1) can suppress color non-uniformity of light to be produced.

Claims

1. A light-emitting device comprising:

a substrate that comprises a base material and a first conductor pattern formed on one principal surface of the base material;

a semiconductor light-emitting element that is mounted on the first conductor pattern; and

a phosphor layer that is formed on the substrate to cover the semiconductor light-emitting element and emits fluorescence as a result of absorption of light emitted from the semiconductor light-emitting element,

wherein a side of the phosphor layer and a side of the substrate are connected continuously.

2. The light-emitting device according to claim 1, wherein the substrate further comprises a second conductor pattern formed on the other principal surface of the base material that is opposite to the one principal surface, and via conductors formed in a thickness direction of the base material for electrically connecting the first conductor pattern and the second conductor pattern.

3. The light-emitting device according to claim 2, wherein the via conductors are formed along sides of the base material.

4. The light-emitting device according to claim 2, wherein the base material comprises a first conductive-type region that is in contact with the first conductor pattern, and a second conductive-type region that is in contact with both the first conductive-type region and the second conductor pattern.

5. A light-emitting module comprising:

the light-emitting device according to claim 1;

and

a main substrate on which the light-emitting device is mounted.

6. A display unit comprising:

the light-emitting module according to claim 5 as a light source.

7. A lighting unit comprising:

the light-emitting module according to claim 5 as a light source.

8. A method for manufacturing a light-emitting device comprising:

mounting a semiconductor light-emitting element on a conductor pattern of a substrate that comprises a base material, with the conductor pattern being formed on one principal surface of the base material;

forming a phosphor layer that emits fluorescence as a result of absorption of light emitted from the semiconductor light-emitting element on the substrate so as to cover the semiconductor light-emitting element; and

cutting out the phosphor layer and the substrate at the same time so that a side of the phosphor layer and a side of the substrate are connected continuously.