Methods and apparatus for installing a feed through filter
First Claim
1. A method of installing a filter into an electronic circuit board, wherein the filter includes a first section having a first contact and a first width and a second section having a second contact and a second width that is narrower than the first width, the filter also includes a first lead extending from the first contact and a second lead, said method comprising:
- inserting the second section into an aperture defined in the electronic circuit board, such that the first section is secure against an electronic circuit board first surface and the first lead extends to a solder pad on the electronic circuit board first surface;
coupling the second lead to the second contact such that the second lead extends to a solder pad on an electronic circuit board second surface; and
reflowing the circuit board such that the first lead is soldered to the electronic circuit board first surface, and the second lead is soldered to the electronic circuit board second surface.
1 Assignment
0 Petitions
Accused Products
Abstract
A method of installing a filter into an electronic circuit board is provided. The method includes inserting a second section of the filter into an aperture defined in the electronic circuit board, such that a first section of the filter is secure against an electronic circuit board first surface and a first lead of the filter extends to a solder pad on the electronic circuit board first surface. The method also includes coupling a second lead to a second contact of the filter such that the second lead extends to a solder pad on an electronic circuit board second surface. The method also includes reflowing the circuit board such that the first lead is soldered to the electronic circuit board first surface, and the second lead is soldered to the electronic circuit board second surface.
29 Citations
26 Claims
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1. A method of installing a filter into an electronic circuit board, wherein the filter includes a first section having a first contact and a first width and a second section having a second contact and a second width that is narrower than the first width, the filter also includes a first lead extending from the first contact and a second lead, said method comprising:
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inserting the second section into an aperture defined in the electronic circuit board, such that the first section is secure against an electronic circuit board first surface and the first lead extends to a solder pad on the electronic circuit board first surface; coupling the second lead to the second contact such that the second lead extends to a solder pad on an electronic circuit board second surface; and reflowing the circuit board such that the first lead is soldered to the electronic circuit board first surface, and the second lead is soldered to the electronic circuit board second surface. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A filter configured for installation on an electronic circuit board, said filter comprising:
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a first section having a first contact and a first width; a second section having a second contact and a second width that is narrower than said first width, said second section configured to be inserted into an aperture in the electronic circuit board; a first lead extending from said first contact and configured to extend to a solder pad on a first surface of the electronic circuit board; and a second lead configured to couple to said second contact and extend to a solder pad on a second surface of the electronic circuit board, wherein contact between the solder pads and said first and said second lead enables the electronic circuit board to be reflowed. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. An electronic system configured to be reflowed, said electronic system comprising:
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an electronic circuit board having a first surface and a second surface; and at least one EMI filter, each EMI filter comprising; a first section having a first contact and a first width; a second section having a second contact and a second width that is narrower than said first width, said second section inserted into said electronic circuit board such that said first section is secure against said electronic circuit board first surface; a first lead extending from said first contact to a solder pad on a said electronic board first surface; and a second lead coupled to said second contact and extending to a solder pad on said electronic circuit board second surface, wherein contact between said solder pads and said first and said second leads enables said electronic system to be reflowed. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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21. A lead for a feed through filter, said lead comprising:
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an attachment member configured to engage a contact of the feed through filter; and an elongated member extending from said body and configured to contact a solder pad of an electronic circuit board such that the electronic circuit board can be reflowed. - View Dependent Claims (22, 23, 24, 25, 26)
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Specification