Electronic Component And Methods Relating To Same

• US 20080036566A1
• Filed: 08/08/2007
• Published: 02/14/2008
• Est. Priority Date: 08/09/2006
• Status: Abandoned Application

• Current Assignee: Coilcraft Incorporated
• Original Assignee: Coilcraft Incorporated
• Inventors: Klesyk, Andrzej, Lestarge, Lawrence B., Hess, Scott D.
• Application Number:
  US11/836,043
• Publication Number:
  US 20080036566A1
• Time in Patent Office: Days
• US Class Current: 336/84M
• CPC Class Codes: H01F 2017/046 helical coil made of flat wire, e.g. with smaller extension of wire cross section in the direction of the longitudinal axis
• CPC Class Codes: H01F 27/027 specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
• CPC Class Codes: H01F 27/04 Leading of conductors or axles through casings, e.g. for tap-changing arrangements
• CPC Class Codes: H01F 27/24 Magnetic cores
• CPC Class Codes: H01F 27/255 made from particles H01F27/26 takes precedence
• CPC Class Codes: H01F 27/2823 Wires H01F27/2866 takes precedence
• CPC Class Codes: H01F 27/29 Terminals; Tapping arrangements for signal inductances
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01F 27/32 Insulating of coils, windings, or parts thereof
• CPC Class Codes: H01F 3/12 Magnetic shunt paths
• CPC Class Codes: H01F 41/10 Connecting leads to windings making electric connections in general H01R43/00
• CPC Class Codes: Y10T 29/49071 by winding or coiling

Abstract

An electronic component including a core having a wire wound around a portion of the core with first and second ends being connected to terminals for mounting the component to corresponding lands in a circuit. The component having an outer body made of a mixture of magnetic and/or non-magnetic material and a binder which can either be potted and cured or compression molded. The mixture encasing at least a portion of the core and wire and leaving at least a portion of the terminals exposed for mounting the component to the circuit using conventional pick-and-place equipment. Further, methods of manufacturing such components and customizing same are disclosed.

Claims

1. An electronic component comprising:

a tack core;

a wire wound about the tack core and having first and second ends either connected to or forming terminals for mounting the component to a circuit;

first and second terminals connected to the first and second ends of the wire and providing electrical contacts for connecting the component into a circuit; and

a body comprising a mixture of magnetic or non-magnetic material which is formed about at least a portion of the tack core and wire leaving at least a portion of the terminals exposed for mounting the component to the circuit.

2. The electronic component of claim 1 wherein the tack core is made of ferrite and has a flanged end with a central post extending therefrom about which the wire is wound.

3. The electronic component of claim 1 wherein the mixture of magnetic or non-magnetic material includes a resin and is compression molded into a solid structure encasing at least a portion of the core and wire.

4. The electronic component of claim 3 wherein the mixture includes 80-98% iron and ferrite powder by weight and 2-20% resin by weight.

5. The electronic component of claim 1 wherein the mixture of magnetic or non-magnetic material includes an epoxy and is potted and cured into a solid structure encasing at least a portion of the core and wire.

6. The electronic component of claim 5 wherein the mixture includes 70-90% iron and ferrite powder by weight and 10-30% epoxy by weight.

7. The electronic component of claim 1 wherein the wire is a round, insulated twenty-eight to forty-two gauge wire.

8. The electronic component of claim 1 wherein the wire is a flat insulated wire.

9. The electronic component of claim 8 wherein the wire is wound into a plurality of rows coaxially positioned about the core.

10. The electronic component of claim 1 wherein the terminals are connected directly to the core.

11. The electronic component of claim 1 wherein the core and mixture are both made of a non-ferrite powdered iron.

12. The electronic component of claim 1 wherein the core is made of ferrite and the mixture is made of a non-ferrite powdered iron.

13. The electronic component of claim 1 wherein the core and mixture are both made of iron and ferrite powder.

14. The electronic component of claim 1 wherein the mixture includes magnetic and non-magnetic material.

15. An electronic component comprising:

a ferrite tack core having a flanged end with a central post extending therefrom;

a conductive element wound around the central post of the ferrite tack core and having first and second ends connected to respective terminals located at least partially below the tack core; and

a compression molded outer body encasing at least a portion of the conductive element and core, the outer body comprising a mixture of carbonyl iron powder and resin wherein the carbonyl iron powder accounts for 10-98% of the mixture, by weight, and the resin accounts for 2-90% of the mixture, by weight.

16. The electronic component of claim 15 wherein the mixture comprising the compression molded body includes 80-98% carbonyl iron powder, by weight, and 2-20% resin, by weight.

17. An electronic component comprising:

a ferrite tack core having a flanged end with a central post extending therefrom;

a conductive element wound around the central post of the ferrite tack core and having first and second ends connected to respective terminals located at least partially below the tack core; and

a potted and cured outer body encasing at least a portion of the conductive element and core, the outer body comprising a mixture of carbonyl iron powder and epoxy wherein the carbonyl iron powder accounts for 10-90% of the mixture, by weight, and the epoxy accounts for 10-90% of the mixture, by weight.

18. The inductive component of claim 17 wherein the mixture comprising the potted and cured outer body includes 70-90% carbonyl iron powder, by weight, and 10-30% epoxy, by weight.

19. A method of manufacturing an electronic component, comprising:

providing a wire and a tack core having a flanged end and a centrally located post extending therefrom;

winding the wire about the post and connecting ends to terminals for mounting the component to a circuit; and

pouring a mixture of magnetic or non-magnetic material over at least a portion of the wire and tack core and hardening the mixture to form a solid component which can be placed on the circuit using conventional pick-and-place equipment.

20. The method of claim 19 wherein pouring and hardening the mixture comprises compression molding the component into a hardened body.

21. The method of claim 19 wherein pouring and hardening the mixture comprises potting and curing the component into a hardened body.

22. The method of claim 19 wherein the wire is a flat, insulated wire and winding comprises winding the flat wire around the core into a plurality of rows coaxially configured about the core.

23. The method of claim 19 further comprising connecting terminals directly to the core of the component so that the component can be mounted to a pair of corresponding lands on the circuit.

24. The method of claim 23 wherein connecting the terminals comprises metalizing a surface of the core.

25. The method of claim 23 wherein connecting the terminals comprises securing clips to the core.

26. An electronic component comprising:

a core having a plurality of terminals connected thereto for connecting the electronic component into a circuit;

a wire wound about the core and having first and second ends, each end being connected to at least one of the plurality of terminals; and

a body comprising a mixture of magnetic or non-magnetic material which is formed about at least a portion of the core and wire leaving at least a portion of the terminals exposed for mounting the component to the circuit.

27. The electronic component of claim 26 wherein the mixture includes magnetic and non-magnetic material.

28. The electronic component of claim 26 wherein the mixture includes 80-98% iron and ferrite powder by weight and 2-20% resin by weight and is compression molded to form a hardened outer body.

29. The electronic component of claim 26 wherein the mixture includes 70-90% iron and ferrite powder by weight and 10-30% epoxy by weight and is potted and cured to form a hardened outer body.

30. The electronic component of claim 26 wherein the core includes iron and ferrite powder.

31. The electronic component of claim 26 wherein the core is shaped as a rod, drum or torroid.

32. An electronic component comprising:

a core;

a wire wound about the core and having first and second ends, each end being connected to at least one of the plurality of terminals; and

a body comprising a mixture of ferrite and iron powder material which is formed about at least a portion of the core and wire leaving at least a portion of the terminals exposed for mounting the component to the circuit.

33. The electronic component of claim 32 wherein the mixture includes 80-98% iron and ferrite powder by weight and 2-20% resin by weight and is compression molded to form a hardened outer body.

34. The electronic component of claim 32 wherein the mixture includes 70-90% iron and ferrite powder by weight and 10-30% epoxy by weight and is potted and cured to form a hardened outer body.

35. A method of manufacturing an electronic component, comprising:

providing a wire having first and second ends, a core about which the wire may be wound, and at least one terminal for connecting to the wire;

winding the wire about the core and connecting the wire to the at least one terminal;

liquefying a powdered mixture of magnetic or non-magnetic materials to create a liquefied mixture; and

dispersing the liquefied mixture over at least a portion of the wire and hardening the mixture to form the electronic component.

36. The method of claim 35 wherein the core has a flanged end and a post extending therefrom and the method further comprises:

winding the wire about the post; and

dispersing the liquefied mixture over at least a portion of the wire and core, and hardening the mixture to form the electronic component.

37. The method of claim 36 further comprising grinding the at least one terminal into a plurality of terminals to provide a multi-terminal electronic component.

38. The method of claim 36 wherein dispersing the liquefied mixture comprises compressing the liquefied mixture over at least a portion of the wire, core and/or terminals.

39. A method of manufacturing an electronic component, comprising:

providing a wire having first and second ends, a tack core having a flanged end and a centrally located post extending therefrom about which the wire may be wound, and terminals for connecting to respective ends of the wire;

winding the wire about the post and connecting the wire ends to the terminals; and

injection molding a mixture of magnetic or non-magnetic material over at least a portion of the wire and tack core and hardening the mixture to form a solid component which can be placed on a circuit using conventional pick-and-place equipment.