Component Arrangement Provided With a Carrier Substrate
First Claim
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1. A component arrangement comprising:
- a carrier substrate;
a component on the carrier substrate; and
a cover layer on the carrier substrate, the cover layer being over the component forming a seal with the carrier substrate to seal the component;
wherein the carrier substrate comprises;
a glass film, and an intermediate layer on a side of the glass film.
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Accused Products
Abstract
A component arrangement includes a carrier substrate having at least one component arranged thereon. The carrier substrate contains at least one layer of glass film and an intermediate layer, which is mounted on at least one side of the glass film. The component is covered and sealed by a cover layer mounted on the carrier substrate.
112 Citations
22 Claims
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1. A component arrangement comprising:
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a carrier substrate;
a component on the carrier substrate; and
a cover layer on the carrier substrate, the cover layer being over the component forming a seal with the carrier substrate to seal the component;
wherein the carrier substrate comprises;
a glass film, and an intermediate layer on a side of the glass film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification