Method of Manufacturing Image Sensor

• US 20080038864A1
• Filed: 08/07/2007
• Published: 02/14/2008
• Est. Priority Date: 08/10/2006
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Park, Byung-jun, Lee, Yun-ki, Yoo, Gil-sang
• Granted Patent: US 7,803,653 B2
• Time in Patent Office: Days
• US Class Current: 438/70
• CPC Class Codes: H01L 27/14609 Pixel-elements with integrated switching, control, storage or amplification elements scanning details of imagers (circuitry of solid-state image sensors H04N25/00); circuitry of imagers H04N25/70
• CPC Class Codes: H01L 27/14621 Colour filter arrangements
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/1464 Back illuminated imager structures
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 27/14689 MOS based technologies

Abstract

A method of manufacturing an image sensor includes forming a device isolation region in an active pixel sensor area of a semiconductor substrate and alignment keys in a scribe lane area of the semiconductor substrate, such that the depth of the alignment keys is equal to or shallower than the depth of the device isolation region. The method further includes forming a photoelectric converter in the active pixel sensor area, polishing a rear surface of the semiconductor substrate and using the alignment keys to form a microlens at a position corresponding to the photoelectric converter on the polished rear surface of the semiconductor substrate.

Claims

1. A method of manufacturing an image sensor, the method comprising:

forming a device isolation region in an active pixel sensor area of a semiconductor substrate and alignment keys in a scribe lane area of the semiconductor substrate, such that the depth of the alignment keys is equal to or shallower than the depth of the device isolation region;

forming a photoelectric converter in the active pixel sensor area;

polishing a rear surface of the semiconductor substrate; and

using the alignment keys to form a microlens at a position corresponding to the photoelectric converter on the polished rear surface of the semiconductor substrate.

2. The method of claim 1, wherein the forming of the device isolation region and the alignment keys comprises:

forming a first trench in the active pixel sensor area and a second trench in the scribe lane area; and

filling up the first and second trenches with an insulating material.

3. The method of claim 2, wherein the first and second trenches are simultaneously formed.

4. The method of claim 2, wherein the insulating material of the second trench has substantially the same etching selectivity as an interlayer insulating film formed on the photoelectric converter.

5. The method of claim 2, wherein the insulating material of the second trench has a low etching selectivity with respect to the semiconductor substrate.

6. The method of claim 4, wherein the insulating material is an oxide film.

7. The method of claim 2, wherein depth of the second trench is formed about 400 to about 500 angstroms (Å

).

8. The method of claim 1, wherein the using of the alignment keys comprises:

forming a mask pattern for opening the scribe lane area on the entire polished rear surface of the semiconductor substrate; and

etching the polished rear surface of the semiconductor substrate using the mask pattern to expose the alignment keys.

9. The method of claim 1, further comprising:

forming a color filter at the position corresponding to the photoelectric converter before forming the microlens.

18. The method of claim 5, wherein the insulating material is an oxide film.

10. A method of manufacturing an image sensor, the method comprising:

forming a device isolation region in an active pixel sensor area of a semiconductor substrate and alignment keys in a scribe lane area of the semiconductor substrate, such that the depth of the alignment keys is equal to or shallower than the depth of the device isolation region;

forming a photoelectric converter in the active pixel sensor area;

forming a multi-layer wiring line in an interlayer insulating film formed on the active pixel sensor area;

polishing a rear surface of the semiconductor substrate;

forming a mask pattern for opening the scribe lane area on the entire polished rear surface of the semiconductor substrate;

etching the polished rear surface of the semiconductor substrate using the mask pattern to expose the alignment keys; and

using the alignment keys to form a microlens at a position corresponding to the photoelectric converter on the polished rear surface of the semiconductor substrate.

11. The method of claim 10, wherein the forming of the device isolation region and the alignment keys comprises:

forming a first trench in the active pixel sensor area and a second trench in the scribe lane area; and

filling up the first and second trenches with an insulating material.

12. The method of claim 11, wherein the first and second trenches are simultaneously formed.

13. The method of claim 11, wherein the insulating material of the second trench has substantially the same etching selectivity as an interlayer insulating film formed on the photoelectric converter.

14. The method of claim 11, wherein the insulating material of the second trench has a low etching selectivity with respect to the semiconductor substrate.

15. The method of claim 13, wherein the insulating material is an oxide film.

16. The method of claim 11, wherein depth of the second trench is about 400 to about 500 angstroms (Å

).

19. The method of claim 14, wherein the insulating material is an oxide film.

17. The method of claim I 1, further comprising:

forming a color filter at the position corresponding to the photoelectric converter before forming the microlens.