Heat pump cycle device

• US 20080041071A1
• Filed: 04/05/2007
• Published: 02/21/2008
• Est. Priority Date: 04/07/2006
• Status: Abandoned Application

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Itoh, Satoshi
• Application Number:
  US11/784,107
• Publication Number:
  US 20080041071A1
• Time in Patent Office: Days
• US Class Current: 62/79
• CPC Class Codes: B60H 1/00342 of the liquid-liquid type
• CPC Class Codes: B60H 1/00899 Controlling the flow of liquid in a heat pump system controlling the properties of the refrigerant liquid, e.g. pressure or temperature, B60H1/3204
• CPC Class Codes: B60H 2001/00928 comprising a secondary circuit
• CPC Class Codes: B60H 2001/00949 comprising additional heating/cooling sources, e.g. second evaporator
• CPC Class Codes: F25B 2309/061 with cycle highest pressure above the supercritical pressure
• CPC Class Codes: F25B 2400/0411 for the expansion valve or capillary tube
• CPC Class Codes: F25B 2600/2507 Flow-diverting valves
• CPC Class Codes: F25B 29/003 of the compression type system
• CPC Class Codes: F25B 39/04 Condensers
• CPC Class Codes: F25B 40/00 Subcoolers, desuperheaters or superheaters
• CPC Class Codes: F25B 9/008 the refrigerant being carbon dioxide
• CPC Class Codes: F28D 7/0025 the conduits for one medium or the conduits for both media being flat tubes or arrays of tubes
• CPC Class Codes: F28D 7/0066 Multi-circuit heat-exchangers, e.g. integrating different heat exchange sections in the same unit or heat-exchangers for more than two fluids F28D7/103 takes precedence
• CPC Class Codes: F28D 7/0083 with units having particular arrangement relative to a supplementary heat exchange medium, e.g. with interleaved units or with adjacent units arranged in common flow of supplementary heat exchange medium

Abstract

A heat pump cycle device includes a compressor for drawing and compressing refrigerant, a first high-pressure heat exchanger located for heating a first fluid circulating in a first fluid circuit using high-pressure refrigerant discharged from the compressor, a second high-pressure heat exchanger for heating a second fluid circulating in a second fluid circuit using the high-pressure refrigerant flowing out of the first high-pressure heat exchanger, a first heating heat exchanger located to heat a third fluid using the first fluid, a second heating heat exchanger located to heat the third fluid using the second fluid, a decompression unit located to decompress the high-pressure refrigerant flowing out of the second high-pressure heat exchanger, and a low-pressure heat exchanger for evaporating low-pressure refrigerant decompressed by the decompression unit. Because the first and second high-pressure heat exchangers are located, cycle efficiency can be improved.

Claims

1. A heat pump cycle device comprising:

a compressor for drawing and compressing refrigerant;

a first high-pressure heat exchanger located to heat a first fluid circulating in a first fluid circuit, using high-pressure refrigerant discharged from the compressor;

a second high-pressure heat exchanger located to heat a second fluid circulating in a second fluid circuit, using the high-pressure refrigerant flowing out of the first high-pressure heat exchanger;

a first heating heat exchanger located to heat a third fluid using the first fluid;

a second heating heat exchanger located to heat the third fluid using the second fluid;

a decompression unit located to decompress the high-pressure refrigerant flowing out of the second high-pressure heat exchanger; and

a low-pressure heat exchanger which is located to evaporate low-pressure refrigerant decompressed by the decompression unit.

2. The heat pump cycle device according to claim 1, wherein the first heating heat exchanger is located downstream of the second heating heat exchanger in a flow direction of the third fluid.

3. The heat pump cycle device according to claim 1, wherein the first high-pressure heat exchanger has a refrigerant passage extending to a refrigerant passage of the second high-pressure heat exchanger.

4. The heat pump cycle device according to claim 1, wherein the high-pressure refrigerant discharged from the compressor is higher than a critical pressure of the refrigerant.

5. The heat pump cycle device according to claim 1, wherein the refrigerant is carbon dioxide.

6. The heat pump cycle device according to claim 1, further comprising a heat generating unit located in the first fluid circuit.

7. The heat pump cycle device according to claim 1, further comprising

a heat generating unit located in the second fluid circuit.

8. The heat pump cycle device according to claim 1, wherein the high-pressure refrigerant is used as a first heat source, the device further comprising:

a second heat source located in the first fluid circuit to supply a heat quantity to the first fluid; and

a third heat source located in the second fluid circuit to supply a heat quantity to the second fluid, which is smaller than the heat quantity supplied from the second heat source.

9. The heat pump cycle device according to claim 1, wherein:

the decompression unit includes a first decompression portion for decompressing the high-pressure refrigerant from the second high-pressure heat exchanger in a first operation mode, and a second decompression portion for decompressing the high-pressure refrigerant bypassing the first decompression portion in a second operation mode; and

the low-pressure heat exchanger includes a first evaporator for evaporating the refrigerant decompressed in the first decompression portion in the first operation mode, and a second evaporator for evaporating the refrigerant decompressed in the second decompression portion in the second operation mode.

10. The heat pump cycle device according to claim 9, wherein the second evaporator is located in a third fluid passage in which the third fluid flows, at an upstream side of the first and second heating heat exchangers in a flow direction of the third fluid.

11. The heat pump cycle device according to claim 1, wherein the first fluid circuit is provided independently from the second fluid circuit.

12. An air conditioner having the heat pump cycle device according to claim 1, wherein the third fluid is air.

13. A vehicle air conditioner having the heat pump cycle device according to claim 1, wherein:

the high-pressure refrigerant is a first heat source;

the first fluid circuit is a water circuit in which water as the first fluid circulates, and is provided with an engine for driving the vehicle as a second heat source; and

the low-pressure heat exchanger is located to cool air as the third fluid.