FLEXIBLE ELECTRONIC ASSEMBLY

• US 20080041617A1
• Filed: 09/29/2006
• Published: 02/21/2008
• Est. Priority Date: 08/18/2006
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Chen, Chun-Jung, Liou, Jian-Chiun, Chuang, Yu-Hung
• Granted Patent: US 7,885,079 B2
• Time in Patent Office: Days
• US Class Current: 174/260
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/09018 Rigid curved substrate

Abstract

A flexible electronic assembly including a flexible circuit board and at least one electronic component is provided. The flexible circuit board includes at least one dielectric film layer and at least one patterned conductive layer disposed on the dielectric film layer. The electronic component is disposed on the flexible circuit board and electrically connected to the flexible circuit board. The flexible angle of the flexible electronic assembly is greater than 5 degrees.

Claims

1. A flexible electronic assembly, comprising:

a flexible circuit board, comprising;

at least one dielectric film layer; and

at least one patterned conductive layer, disposed on the dielectric film layer; and

at least one electronic component, disposed on the flexible circuit board and electrically connected to the flexible circuit board, wherein a flexible angle of the flexible electronic assembly is greater than 5 degrees.

2. The flexible electronic assembly as claimed in claim 1, wherein a material of the dielectric film layer includes polyimide, glass epoxy resin, polyester, or bismaleimide-triazine resin.

3. The flexible electronic assembly as claimed in claim 1, wherein the electronic component comprises a logic control component or a driving component.

4. The flexible electronic assembly as claimed in claim 1, wherein the electronic component comprises a light emitting diode, a photodiode, a radio frequency identification (RFID) electronic component, a heterojunction bipolar transistor (HBT), or a high frequency integrated circuit component.

5. The flexible electronic assembly as claimed in claim 1, wherein a number of the patterned conductive layers is two, a number of the dielectric film layer is one, and the patterned conductive layers are respectively disposed on two opposite surfaces of the dielectric film layer.

6. The flexible electronic assembly as claimed in claim 5, wherein the flexible circuit board further comprises at least one conductive via passing through the dielectric film layer, and the patterned conductive layers are electrically connected through the conductive via.

7. The flexible electronic assembly as claimed in claim 5, wherein a number of the electronic components is more than one, and the electronic components are disposed on the patterned conductive layers.

8. The flexible electronic assembly as claimed in claim 1, wherein a number of the patterned conductive layers is three, a number of the dielectric film layers is two, and each of the dielectric film layers is disposed between two adjacent patterned conductive layers.

9. The flexible electronic assembly as claimed in claim 8, wherein the flexible circuit board further comprises at least one conductive via passing through the at least one dielectric film layer, and at least two of the patterned conductive layers are electrically connected through the conductive via.

10. The flexible electronic assembly as claimed in claim 8, wherein a number of the electronic components is more than one, and the electronic components are disposed on the outmost patterned conductive layers.

11. The flexible electronic assembly as claimed in claim 1, wherein the electronic component has a plurality of bumps, and the electronic component is electrically connected to the flexible circuit board through the bumps.

12. The flexible electronic assembly as claimed in claim 11, wherein a material of the bumps comprises tin, lead, or tin-lead alloy.

13. The flexible electronic assembly as claimed in claim 11, wherein a material of the bumps includes gold.