White Light Emitting Device and Method for Manufacturing the Same

• US 20080042150A1
• Filed: 06/22/2005
• Published: 02/21/2008
• Est. Priority Date: 06/23/2004
• Status: Abandoned Application

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Yamaguchi, Tomoji
• Application Number:
  US11/629,999
• Publication Number:
  US 20080042150A1
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/11 Manufacturing methods
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/92125 the second connecting process involving a layer connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder

Abstract

There are provided a white light emitting device of high luminous efficiency prevented from luminance deterioration even in large electric current range, and a method for manufacturing the same with high production yield. The white light emitting device (1) is composed of a blue LED element (4) and an oxide layer (8) containing a fluorescent material which is integrated with the blue LED element (4). In the blue LED element (4), a p-side electrode (11) is formed on a surface of a p-type layer of epitaxial layers (6) formed by laminating GaN based compound semiconductor layers on a surface of a light transmitting crystal substrate (3), and an n-side electrode (10) is formed on a bottom surface of a recessed portion (9) which is an n-type layer exposed by selectively etching a part of the p-type layer and the light emitting layer. The oxide layer (8) is formed by sintering a YAG fluorescent material and a glass binder containing mainly SiO₂, B₂O₃ and PbO for binding the fluorescent material. The white light emitting device emits white light to the out side by converting blue light emitted from the blue LED element in the oxide layer (8).

Claims

1. :

A light emitting device having a light emitting layer formed with GaN based compound semiconductor layers, comprising;

an n-side electrode and a p-side electrode formed on one side of the emitting layer;

an n-type layer made of a GaN based compound semiconductor laminated on the n-side electrode;

semiconductor layers made of the GaN based compound semiconductor including an active layer laminated on the p-side electrode;

a light transmitting crystal substrate provided on the semiconductor layers made of the GaN based compound semiconductor; and

an oxide layer containing a fluorescent material formed on an opposite surface to the semiconductor layers and a side face of the light transmitting crystal substrate.

2. :

The light emitting device according to claim 1, wherein the oxide layer containing the fluorescent material is formed by binding the fluorescent material with glass, principal components of the glass being SiO2 and B2O3, SiO2, B2O3 and ZnO, or SiO2, B2O3 and PbO.

3. :

The light emitting device according to claim 1, wherein the oxide layer containing the fluorescent material comprises a porous layer in which fluorescent material particles are bridged with glass by mixing the fluorescent material of 60% or more to an oxide constituting the glass.

4. :

The light emitting device which can emit white light according to claim 1, wherein the fluorescent material is made of a fluorescent material converting blue light into light of a complimentary color or a fluorescent material converting blue light into green light and red light.

5. :

The light emitting device which can emit white light according to claim 1, wherein the fluorescent material is made of a fluorescent material converting ultraviolet light into blue light, green light and red light.

6. :

A block light emitting device comprising,

a plurality of unit light emitting devices arranged in a structure of a matrix shape, each of the unit light emitting devices being the light emitting device of claim 1.

7. :

A method for manufacturing a light emitting device having a light emitting layer formed with GaN based compound semiconductor layers comprising steps of;

preparing a wafer in which a structure of a light emitting diode is formed by laminating epitaxial layers having the light emitting layer composed of at least GaN based compound semiconductor layers on a surface of a light transmitting crystal substrate by an epitaxial vapor growth technique;

forming grooves at least at positions of dividing the wafer into chips on the other surface of the light transmitting crystal substrate;

forming an oxide layer containing a fluorescent material on the other surface of the light transmitting crystal substrate of the wafer so that the oxide layer is embedded in the grooves, and formed in a determined height, from the other surface;

forming a p-side electrode and an n-side electrode on a surface of the epitaxial layers side; and

dividing a wafer into chips by dicing the oxide layer in the groove along a boarder of a unit light emitting device which includes a plurality of light emitting portions having a continuous epitaxial layer of one conductivity type layer in the light emitting portions, or a block light emitting device in which a plurality of the unit light emitting devices are formed by separating the epitaxial layers electrically.

8. :

The manufacturing method according to claim 7, further comprising a step of forming grooves by working the light transmitting crystal substrate to make the grooves at boarders of light emitting diodes in which at least one conductivity type layer is divided.

9. :

The manufacturing method according to claim 7, further comprising a step of adjusting chromaticity to adjust the chromaticity of emitted light by adjusting a thickness of the oxide layer containing the fluorescent material by grinding.