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High power light emitting diode package and method of producing the same

  • US 20080042151A1
  • Filed: 06/13/2007
  • Published: 02/21/2008
  • Est. Priority Date: 07/10/2006
  • Status: Active Grant
First Claim
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1. A high power light emitting diode package comprising:

  • a plurality of light emitting diode chips;

    a first lead frame with the plurality of light emitting diode chips mounted thereon and a second lead frame disposed apart at a predetermined interval from the first lead frame;

    a package body fixing the first and second lead frames; and

    bonding wires for electrically connecting the plurality of light emitting diode chips,wherein the package body comprises at least one first reflecting part separately surrounding each of the plurality of light emitting diode chips with upward-inclined inner side walls thereof, and a second reflecting part surrounding the entire plurality of light emitting diode chips with an upward-inclined inner side wall thereof.

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