MICROELECTROMECHANICAL SYSTEM PACKAGE AND METHOD FOR MAKING THE SAME

• US 20080042223A1
• Filed: 08/17/2006
• Published: 02/21/2008
• Est. Priority Date: 08/17/2006
• Status: Abandoned Application

• Current Assignee: Merry Electronics Company Limited
• Original Assignee: Merry Electronics Company Limited
• Inventors: Gong, Shih-Chin, Liao, Lu-Lee, Her, Hong-Ching
• Application Number:
  US11/465,249
• Publication Number:
  US 20080042223A1
• Time in Patent Office: Days
• US Class Current: 257/415
• CPC Class Codes: H04R 19/00 Electrostatic transducers

Abstract

A microelectromechanical system package includes a substrate, a microelectromechanical system transducer mounted on the substrate by a plurality of metal bumps, a non-conductive polymer ring provided around the microelectromechanical transducer for avoiding the leakage of sound pressure from the microelectromechanical transducer, an integrated circuit mounted on the substrate by a plurality of metal bumps for matching the impedance of the microelectromechanical system transducer or amplifying the electric signals and an electrically conductive bridge for electrically connecting the integrate circuit to the substrate.

Claims

1. A microelectromechanical system package comprising:

a substrate;

a microelectromechanical transducer mounted on the substrate by a plurality of metal bumps;

a non-conductive polymer ring provided around the microelectromechanical transducer for avoiding the leakage of sound pressure from the microelectromechanical transducer;

an integrated circuit mounted on the substrate by a plurality of metal bumps for matching the impedance of the micromechanical system transducer or amplifying the electrical signals; and

an electrically conductive bridge for electrically connecting the integrate circuit to the substrate.

2. The microelectromechanical system package according to claim 1 wherein the electrically conductive bridge is made of electrically conductive polymer material.

3. The microelectromechanical system package according to claim 1 wherein the electrically conductive bridge comprises an electrically conductive layer on the backside of the integrated circuit and an electrically conductive wire with an end connected to the electrically conductive layer and another end connected to the substrate.

4. The microelectromechanical system package according to claim 1 wherein the electrically conductive bridge comprises a lid mounted on the microelectromechanical transducer and the integrated circuit and an electrically conductive wire with an end connected to the lid and another end connected to the substrate so that the lid is grounded.

5. The microelectromechanical system package according to claim 4 wherein the lid comprises an acoustic aperture defined therein corresponding to the microelectromechanical system transducer so that sound pressure can reach the microelectromechanical transducer through the acoustic aperture.

6. The microelectromechanical system package according to claim 4 wherein the substrate comprises an acoustic aperture defined therein corresponding to the microelectromechanical transducer so that sound pressure can reach the microelectromechanical transducer through the acoustic aperture.

7. The microelectromechanical system package according to claim 6 wherein the electrically conductive wire is made of gold or aluminum.

8. The microelectromechanical system package according to claim 1 comprising a solder ring around the substrate for reducing electromagnetic interference, thus protecting the receipt of sound pressure by the microelectromechanical transducer from noises.

9. The microelectromechanical system package according to claim 1 wherein the substrate is a printed circuit board or a ceramic board.

10. The microelectromechanical system package according to claim 1 wherein the metal bumps are solder bumps or gold bumps.

11. A method for making a microelectromechanical system package comprising the steps of:

providing a substrate;

providing a solder pad on the substrate by a screen printing technique;

providing, on the substrate, a microelectromechanical system transducer with a plurality of metal bumps and an integrated circuit with a plurality of metal bumps;

subjecting the substrate, the microelectromechanical system transducer and the integrated circuit to a reflow process in a reflow oven;

providing a non-conductive polymer ring around the microelectromechanical transducer;

providing an electrically conductive bridge for electrically connecting the integrated circuit to the substrate; and

subjecting the substrate, the microelectromechanical system transducer and the integrated circuit to a curing process.

12. The method according to claim 11 wherein the step of providing an electrically conductive bridge comprises the step of providing a polymer dot between the integrated circuit and the substrate.

13. The method according to claim 11 wherein the step of providing an electrically conductive bridge comprises the step of providing an electrically conductive layer on the integrated circuit and the step of electrically connecting the electrically conductive layer to the substrate by providing the electrically conductive wire.

14. The method according to claim 13 wherein the electrically conductive wire is provided by a wire bond technique.

15. The method according to claim 11 wherein the step of providing an electrically conductive bridge comprises the step of providing a lid on the microelectromechanical system transducer and the integrated circuit and the step of electrically connecting the lid to the substrate by providing an electrically conductive wire.

16. The method according to claim 15 wherein the electrically conductive wire is provided by the wire bond technique.

17. The method according to claim 15 wherein the step of providing the lid comprises the step of making an acoustic aperture in the lid corresponding to the microelectromechanical system transducer.

18. The method according to claim 15 wherein the step of providing the substrate comprises the step of making an acoustic aperture in the substrate corresponding to the microelectromechanical system transducer.

19. The method according to claim 11 wherein the step of providing a solder pad comprises the step of providing a solder ring on and around the substrate by a screen printing technique.