STACKABLE CERAMIC FBGA FOR HIGH THERMAL APPLICATIONS
First Claim
Patent Images
1. An assembly comprising:
- a first carrier having a cavity, a first frusto-conical surface on a portion thereof, a second frusto-conical surface on another portion thereof, a lip on a portion of a bottom surface thereof, and a plurality of circuits located within a portion of the cavity;
a semiconductor device having a plurality of bond pads located within the cavity of the first carrier;
a first connector between at least one circuit of the plurality of circuits located within the portion of the cavity of the first carrier and at least one bond pad of the plurality of bond pads of the semiconductor device;
encapsulant material filling a portion of the cavity in the first carrier; and
a second connector material located within the first carrier.
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0 Petitions
Accused Products
Abstract
An apparatus package for high-temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.
109 Citations
25 Claims
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1. An assembly comprising:
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a first carrier having a cavity, a first frusto-conical surface on a portion thereof, a second frusto-conical surface on another portion thereof, a lip on a portion of a bottom surface thereof, and a plurality of circuits located within a portion of the cavity;
a semiconductor device having a plurality of bond pads located within the cavity of the first carrier;
a first connector between at least one circuit of the plurality of circuits located within the portion of the cavity of the first carrier and at least one bond pad of the plurality of bond pads of the semiconductor device;
encapsulant material filling a portion of the cavity in the first carrier; and
a second connector material located within the first carrier. - View Dependent Claims (2, 3, 4)
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5. An assembly comprising:
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a first carrier having a cavity therein, a first surface, a second surface, at least one connection pad on the first surface, at least one connection pad on the second surface, a circuit connecting the at least one connection pad on the first surface to the at least one connection pad on the second surface, and at least one circuit located in a portion of the cavity connected to one of the at least one connection pad on the first surface and the at least one connection pad on the second surface;
a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier;
a first connector between the at least one circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; and
encapsulant material filling a portion of the cavity in the first carrier. - View Dependent Claims (6, 7, 8, 9)
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10. An assembly comprising:
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a first carrier having a cavity therein, a first surface, a second surface, at least aperture extending therethrough, and at least one circuit located in a portion of the cavity extending to the at least one aperture;
a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier;
a first connector between the at least one circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device;
encapsulant material filling a portion of the cavity in the first carrier; and
connector material located in the at least one aperture in the first carrier. - View Dependent Claims (11, 12, 13, 14)
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15. An assembly of stacked carriers comprising:
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a first carrier having a first frusto-conical surface on a portion thereof, a second frusto-conical surface on another portion thereof, a lip on a portion of a bottom surface thereof, and a plurality of circuits located within a portion of a cavity;
a semiconductor device having a plurality of bond pads located within the cavity of the first carrier;
a first connector between at least one circuit of the plurality of circuits located within the portion of the cavity of the first carrier and at least one bond pad of the plurality of bond pads of the semiconductor device;
encapsulant material filling a portion of the cavity in the first carrier; and
a second connector material located within the first carrier. - View Dependent Claims (16, 17, 18)
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19. An assembly formed by a plurality of carriers for high thermal usage comprising:
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a first carrier having a cavity therein, a first surface, a second surface, at least one connection pad on the first surface, at least one connection pad on the second surface, a circuit connecting the at least one connection pad on the first surface to the at least one connection pad on the second surface, and at least one circuit located in a portion of the cavity connected to one of the at least one connection pad on the first surface and the at least one connection pad on the second surface;
a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier;
a first connector between the at least one circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; and
encapsulant material filling a portion of the cavity in the first carrier. - View Dependent Claims (20, 21, 22, 23, 24, 25)
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Specification