METHOD OF FORMING A MATERIAL LAYER

• US 20080044593A1
• Filed: 07/24/2007
• Published: 02/21/2008
• Est. Priority Date: 08/17/2006
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Soo-Hwan, Lee, Eun-Taeck, Seo, Jung-Hun
• Application Number:
  US11/782,087
• Publication Number:
  US 20080044593A1
• Time in Patent Office: Days
• US Class Current: 427/569
• CPC Class Codes: C23C 16/08 from metal halides
• CPC Class Codes: C23C 16/34 Nitrides C23C16/303 takes precedence
• CPC Class Codes: C23C 16/4405 Cleaning of reactor or parts inside the reactor by using reactive gases
• CPC Class Codes: C23C 16/45565 Shower nozzles
• CPC Class Codes: C23C 16/4557 Heated nozzles

Abstract

A method of processing a wafer in a chamber including a wafer stage and a showerhead is disclosed. The method includes forming a first protection layer on the wafer stage, heating the wafer stage to a first temperature, heating the showerhead at a second temperature lower than the first temperature, forming a second protection layer on inner surfaces of the process chamber including at least the wafer stage and showerhead, loading a wafer onto the wafer stage, forming a material layer on the wafer, and then unloading the wafer from the wafer stage, and removing by-products generated on the inner surfaces of the process chamber during formation of the material layer while maintaining the first temperature of the wafer stage and the second temperature of the showerhead.

Claims

1. A method of processing a wafer in a chamber including a wafer stage and a showerhead, the method comprising:

forming a first protection layer on the wafer stage;

heating the wafer stage to a first temperature;

heating the showerhead at a second temperature lower than the first temperature;

forming a second protection layer on inner surfaces of the process chamber including at least the wafer stage and showerhead;

loading a wafer onto the wafer stage, forming a material layer on the wafer, and then unloading the wafer from the wafer stage; and

removing by-products generated on the inner surfaces of the process chamber during formation of the material layer while maintaining the first temperature of the wafer stage and the second temperature of the showerhead.

2. The method of claim 1, further comprising:

loading another wafer on the wafer stage following removal of the by-products.

3. The method of claim 1, wherein the first temperature ranges from between 400°

C. to about 700°

C.

4. The method of claim 1, wherein removing the by-products comprises introducing a cleaning gas into the chamber, and the second temperature is substantially lower than a temperature at which material forming the showerhead reacts with the cleaning gas.

5. The method of claim 4, wherein the second temperature ranges from about 150°

C. to about 300°

C.

6. The method of claim 4, wherein the cleaning gas comprises at least one selected from a group of gases consisting of nitrogen trifluoride (NF3) gas and fluorine (F2) gas.

7. The method of claim 4, wherein removing the by-products further comprises generating plasma from the cleaning gas.

8. The method of claim 4, wherein removing the by-products further comprises heating the cleaning gas.

9. The method of claim 1, wherein the first protection layer comprises an aluminum fluoride (AlF3) layer.

10. The method of claim 1, wherein the second protection layer comprises a titanium layer.

11. The method of claim 1, wherein the material layer comprises at least one of a titanium layer and a titanium nitride layer.

12. The method of claim 1, wherein forming the material layer on the wafer comprises:

forming a lower material layer on the wafer; and

forming an upper material layer on the lower layer.

13. The method of claim 12, wherein the lower material layer comprises a titanium layer and the upper layer comprises a titanium nitride layer.