Methods of forming semiconductor light emitting device packages by liquid injection molding and molded semiconductor light emitting device strips
First Claim
1. A semiconductor light emitting device packaging method comprising:
- fabricating a substrate configured to mount a semiconductor light emitting device thereon;
mounting the semiconductor light emitting device on the substrate;
electrically connecting the semiconductor light emitting device to a contact portion of the substrate; and
liquid injection molding the substrate to form an optical element bonded to the substrate over the semiconductor light emitting device.
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Accused Products
Abstract
Semiconductor light emitting device packaging methods include fabricating a substrate configured to mount a semiconductor light emitting device thereon. The substrate may include a cavity configured to mount the semiconductor light emitting device therein. The semiconductor light emitting device is mounted on the substrate and electrically connected to a contact portion of the substrate. The substrate is liquid injection molded to form an optical element bonded to the substrate over the semiconductor light emitting device. Liquid injection molding may be preceded by applying a soft resin on the electrically connected semiconductor light emitting device in the cavity. Semiconductor light emitting device substrate strips are also provided.
76 Citations
31 Claims
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1. A semiconductor light emitting device packaging method comprising:
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fabricating a substrate configured to mount a semiconductor light emitting device thereon; mounting the semiconductor light emitting device on the substrate; electrically connecting the semiconductor light emitting device to a contact portion of the substrate; and liquid injection molding the substrate to form an optical element bonded to the substrate over the semiconductor light emitting device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A semiconductor light emitting device substrate strip, comprising:
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a metal base structure; a plurality of high temperature plastic material substrates on the metal base structure, the substrates including semiconductor light emitting device receiving cavities; and a passageway extending between the receiving cavities configured to direct a flow of resin between the respective receiving chambers. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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Specification