Laminating System
First Claim
1. A laminating system comprising:
- a first substrate provided with at least one thin film integrated circuit;
a first supplying roller on which a second substrate winds;
a peeling roller;
a second supplying roller on which a third substrate winds; and
a sealing means comprising a first roller and a second roller, wherein the first roller and the second roller are opposed to each other;
wherein the second substrate is supplied to the peeling roller by rotating the first supplying roller;
wherein a first surface of the thin film integrated circuit over the first substrate is attached to the second substrate by rotating the peeling roller;
wherein the third substrate is supplied to the second roller by rotating the second supplying roller;
wherein a second surface of the thin film integrated circuit which is opposed to the first surface is attached to the third substrate by rotating the first roller and the second roller; and
wherein the thin film integrated circuit is sealed between the second substrate and the third substrate by performing at least one of a pressure treatment and a heat treatment while the thin film integrated circuit passes between the first roller and the second roller.
1 Assignment
0 Petitions
Accused Products
Abstract
It is an object of the invention to improve the production efficiency in sealing a thin film integrated circuit and to prevent the damage and break. Further, it is another object of the invention to prevent a thin film integrated circuit from being damaged in shipment and to make it easier to handle the thin film integrated circuit. The invention provides a laminating system in which rollers are used for supplying a substrate for sealing, receiving IC chips, separating, and sealing. The separation, sealing, and reception of a plurality of thin film integrated circuits can be carried out continuously by rotating the rollers; thus, the production efficiency can be extremely improved. Further, the thin film integrated circuits can be easily sealed since a pair of rollers opposite to each other is used.
135 Citations
81 Claims
-
1. A laminating system comprising:
-
a first substrate provided with at least one thin film integrated circuit;
a first supplying roller on which a second substrate winds;
a peeling roller;
a second supplying roller on which a third substrate winds; and
a sealing means comprising a first roller and a second roller, wherein the first roller and the second roller are opposed to each other;
wherein the second substrate is supplied to the peeling roller by rotating the first supplying roller;
wherein a first surface of the thin film integrated circuit over the first substrate is attached to the second substrate by rotating the peeling roller;
wherein the third substrate is supplied to the second roller by rotating the second supplying roller;
wherein a second surface of the thin film integrated circuit which is opposed to the first surface is attached to the third substrate by rotating the first roller and the second roller; and
wherein the thin film integrated circuit is sealed between the second substrate and the third substrate by performing at least one of a pressure treatment and a heat treatment while the thin film integrated circuit passes between the first roller and the second roller. - View Dependent Claims (16, 17, 18, 19)
-
-
2. A laminating system comprising:
-
a transfer means to transfer a first substrate provided with at least one thin film integrated circuit;
a first supplying roller on which a second substrate winds;
a peeling roller;
a second supplying roller on which a third substrate winds;
a sealing means comprising a first roller and a second roller; and
a receiving roller, wherein the transfer means and the peeling roller are opposed to each other;
wherein the first roller and the second roller are opposed to each other;
wherein the second substrate is supplied to the peeling roller by rotating the first supplying roller;
wherein a first surface of the thin film integrated circuit over the first substrate is attached to the second substrate by rotating the peeling roller while transferring the first substrate using the transfer means;
wherein the third substrate is supplied to the second roller by rotating the second supplying roller;
wherein a second surface of the thin film integrated circuit which is opposed to the first surface is attached to the third substrate by rotating the first roller and the second roller;
wherein the thin film integrated circuit is sealed between the second substrate and the third substrate by performing at least one of a pressure treatment and a heat treatment while the thin film integrated circuit passes between the first roller and the second roller; and
wherein the thin film integrated circuit which is sealed between the second substrate and the third substrate is wound by rotating the receiving roller. - View Dependent Claims (20, 21, 22, 23, 24)
-
-
3. A laminating system comprising:
-
a first substrate provided with at least one thin film integrated circuit;
a first supplying roller on which a second substrate winds;
a second supplying roller on which a third substrate winds; and
a sealing means comprising a first roller and a second roller, wherein the first roller and the second roller are opposed to each other;
wherein the second substrate is supplied to the first roller by rotating the first supplying roller;
wherein the third substrate is supplied to the second roller by rotating the second supplying roller;
wherein the first roller and the second roller are rotated to attach a first surface of the thin film integrated circuit over the first substrate to the second substrate and to attach a second surface of the thin film integrated circuit which is opposed to the first surface to the third substrate; and
wherein the thin film integrated circuit is sealed between the second substrate and the third substrate by performing at least one of a pressure treatment and a heat treatment while the thin film integrated circuit passes between the first roller and the second roller. - View Dependent Claims (25, 26, 27, 28)
-
-
4. A laminating system comprising:
-
a transfer means to transfer a first substrate provided with at least one thin film integrated circuit;
a first supplying roller on which a second substrate winds;
a second supplying roller on which a third substrate winds;
a sealing means comprising a first roller and a second roller; and
a receiving roller, wherein the transfer means and the sealing means are opposed to each other;
wherein the first roller and the second roller are opposed to each other;
wherein the second substrate is supplied to the first roller by rotating the first supplying roller;
wherein the third substrate is supplied to the second roller by rotating the second supplying roller;
wherein a first surface of the thin film integrated circuit over the first substrate is attached to the second substrate by rotating the first roller while transferring the first substrate using the transfer means;
wherein a second surface of the thin film integrated circuit which is opposed to the first surface is attached to the third substrate by rotating the first roller and the second roller;
wherein the thin film integrated circuit is sealed between the second substrate and the third substrate by performing at least one of a pressure treatment and a heat treatment while the thin film integrated circuit passes between the first roller and the second roller; and
wherein the thin film integrated circuit which is sealed between the second substrate and the third substrate is wound by rotating the receiving roller. - View Dependent Claims (29, 30, 31, 32, 33)
-
-
5. A laminating system comprising:
-
a first substrate comprising a first surface provided with at least one thin film integrated circuit;
a first substrate control means to fix and move the first substrate;
a transfer means to transfer the first substrate;
a first supplying roller on which a second substrate winds;
a second supplying roller on which a third substrate winds;
a sealing means comprising a first roller and a second roller; and
a receiving roller, wherein the first roller and the second roller are opposed to each other;
wherein using the first substrate control means, the first substrate is fixed to be opposed to the second substrate and is moved so that the first surface of the thin film integrated circuit is attached to the second substrate;
wherein a peeling roller having the transfer means is rotated while transferring the first substrate by the transfer means to separate the thin film integrated circuit from the first surface of the first substrate and to supply the second substrate to which the first surface of the thin film integrated circuit is attached to the sealing means;
wherein the third substrate is supplied to the second roller by rotating the second supplying roller;
wherein a second surface of the thin film integrated circuit which is opposed to the first surface is attached to the third substrate by rotating the first roller and the second roller;
wherein the thin film integrated circuit is sealed between the second substrate and the third substrate by performing at least one of a pressure treatment and a heat treatment while the thin film integrated circuit passes between the first roller and the second roller; and
wherein the thin film integrated circuit which is sealed between the second substrate and the third substrate is wound by rotating the receiving roller. - View Dependent Claims (34, 35, 36, 37, 38)
-
-
6. A laminating system comprising:
-
a first substrate provided with at least one thin film integrated circuit;
a first supplying roller on which a second substrate winds;
a peeling roller to separate the thin film integrated circuit from the first substrate by attach a first surface of the thin film integrated circuit over the first substrate to the second substrate;
a second supplying roller on which a third substrate to be attached to a second surface of the thin film integrated circuit winds; and
a sealing means to seal the thin film integrated circuit between the second substrate and the third substrate by performing at least one of a pressure treatment and a heat treatment, wherein the sealing means comprises a first roller and a second roller which are opposed to each other; and
wherein the first surface and the second surface of the thin film integrated circuit are opposed to each other. - View Dependent Claims (39, 40, 41, 42)
-
-
7. A laminating system comprising:
-
a first substrate provided with at least one thin film integrated circuit;
a transfer means to transfer the first substrate;
a first supplying roller on which a second substrate winds;
a peeling roller to separate the thin film integrated circuit from the first substrate by attaching a first surface of the thin film integrated circuit over the first substrate to the second substrate;
a second supplying roller on which a third substrate to be attached to a second surface of the thin film integrated circuit winds;
a sealing means to seal the thin film integrated circuit between the second substrate and the third substrate by performing at least one of a pressure treatment and a heat treatment; and
a receiving roller on which the thin film integrated circuit which is attached between the second substrate and the third substrate winds, wherein the transfer means and the peeling roller are opposed to each other;
wherein the sealing means comprises a first roller and a second roller which are opposed to each other; and
wherein the first surface and the second surface of the thin film integrated circuit are opposed to each other. - View Dependent Claims (43, 44, 45, 46, 47)
-
-
8. A laminating system comprising:
-
a first substrate provided with at least one thin film integrated circuit;
a first supplying roller on which a second substrate to be attached to a first surface of the thin film integrated circuit winds;
a second supplying roller on which a third substrate to be attached to a second surface of the thin film integrated circuit winds; and
a sealing means to seal the thin film integrated circuit between the second substrate and the third substrate by performing at least one of a pressure treatment and a heat treatment, wherein the sealing means comprises a first roller and a second roller which are opposed to each other; and
wherein the first surface and the second surface of the thin film integrated circuit are opposed to each other. - View Dependent Claims (48, 49, 50, 51)
-
-
9. A laminating system comprising:
-
a first substrate provided with at least one thin film integrated circuit;
a transfer means to transfer the first substrate;
a first supplying roller on which a second substrate to be attached to a first surface of the thin film integrated circuit winds;
a second supplying roller on which a third substrate to be attached to a second surface of the thin film integrated circuit winds;
a sealing means to seal the thin film integrated circuit between the second substrate and the third substrate by performing at least one of a pressure treatment and a heat treatment; and
a receiving roller on which the thin film integrated circuit which is sealed between the second substrate and the third substrate winds, wherein the transfer means and the sealing means are opposed to each other;
wherein the sealing means comprises a first roller and a second roller which are opposed to each other; and
wherein the first surface and the second surface of the thin film integrated circuit are opposed to each other. - View Dependent Claims (52, 53, 54, 55, 56)
-
-
10. A laminating system comprising:
-
a first substrate comprising a first surface provided with at least one thin film integrated circuit;
a first substrate control means to fix and move the first substrate;
a transfer means to transfer the first substrate and separate the thin film integrated circuit from the first substrate using a peeling roller;
a first supplying roller on which a second substrate to be attached to the first surface of the thin film integrated circuit winds;
a second supplying roller on which a third substrate to be attached to a second surface of the thin film integrated circuit winds;
a sealing means to seal the thin film integrated circuit between the second substrate and the third substrate by performing at least one of a pressure treatment and a heat treatment; and
a receiving roller on which the thin film integrated circuit which is sealed between the second substrate and the third substrate winds, wherein the sealing means comprises a first roller and a second roller which are opposed to each other; and
wherein the first surface and the second surface of the thin film integrated circuit are opposed to each other. - View Dependent Claims (57, 58, 59, 60, 61)
-
-
11. A method for manufacturing an IC chip comprising:
-
forming a release layer over a first substrate comprising an insulating surface;
forming at least one thin film integrated circuit over the release layer;
forming an opening at a boundary of the thin film integrated circuit, thereby exposing the release layer;
introducing an etchant to the opening, thereby removing the release layer;
rotating a peeling roller to attach a first surface of the thin film integrated circuit to a second substrate, thereby separate the thin film integrated circuit are separated from the first substrate;
rotating a first roller and a second roller to attach a second surface of the thin film integrated circuit to a third substrate; and
sealing the thin film integrated circuit between the second substrate and the third substrate by performing at least one of a pressure treatment and a heat treatment while the thin film integrated circuit passes between the first roller and the second roller, wherein the first surface and the second surface of the thin film integrated circuit are opposed to each other. - View Dependent Claims (62, 63, 64, 65)
-
-
12. A method for manufacturing an IC chip comprising:
-
forming a release layer over a first substrate comprising an insulating surface;
forming at least one thin film integrated circuit over the release layer;
forming an opening at a boundary of the thin film integrated circuit, thereby exposing the release layer;
introducing an etchant to the opening, thereby removing the release layer;
rotating a peeling roller to attach a first surface of the thin film integrated circuit to a second substrate, thereby separating the thin film integrated circuit from the first substrate;
rotating a first roller and a second roller to attach a second surface of the thin film integrated circuit to a third substrate; and
sealing the thin film integrated circuit between the second substrate and the third substrate by performing at least one of a pressure treatment and a heat treatment while the thin film integrated circuit passes between the first roller and the second roller; and
winding the thin film integrated circuit which is sealed between the second substrate and the third substrate by rotating a receiving roller, wherein the first surface and the second surface of the thin film integrated circuit are opposed to each other. - View Dependent Claims (66, 67, 68, 69)
-
-
13. A method for manufacturing an IC chip comprising:
-
forming a release layer over a first substrate comprising an insulating surface;
forming at least one thin film integrated circuit over the release layer;
forming an opening at a boundary of the thin film integrated circuit, thereby exposing the release layer;
introducing an etchant to the opening, thereby removing the release layer;
rotating a first roller and a second roller to attach a first surface of the thin film integrated circuit to a second substrate and to attach a second surface of the thin film integrated circuit to a third substrate; and
sealing the thin film integrated circuit between the second substrate and the third substrate by performing at least one of a pressure treatment and a heat treatment while the thin film integrated circuit passes between the first roller and the second roller, wherein the first surface and the second surface of the thin film integrated circuit are opposed to each other. - View Dependent Claims (70, 71, 72, 73)
-
-
14. A method for manufacturing an IC chip comprising:
-
forming a release layer over a first substrate having an insulating surface;
forming at least one thin film integrated circuit over the release layer;
forming an opening at a boundary of the thin film integrated circuit, thereby exposing the release layer;
introducing an etchant to the opening, thereby removing the release layer;
rotating a first roller to attach a first surface of the thin film integrated circuit over the first substrate to a second substrate;
rotating a first roller and a second roller to attach a second surface of the thin film integrated circuit over the first substrate to a third substrate;
sealing the thin film integrated circuit between the second substrate and the third substrate by performing at least one of a pressure treatment and a heat treatment while the thin film integrated circuit passes between the first roller and the second roller; and
rotating a receiving roller to wind the thin film integrated circuit which is sealed with the second substrate and the third substrate, wherein the first surface and the second surface of the thin film integrated circuit are opposed to each other. - View Dependent Claims (74, 75, 76, 77)
-
-
15. A method for manufacturing an IC chip comprising:
-
forming a release layer over a first substrate comprising an insulating surface;
forming at least one thin film integrated circuit over the release layer;
forming an opening at a boundary of the thin film integrated circuit, thereby exposing the release layer;
introducing an etchant to the opening, thereby removing the release layer;
rotating a peeling roller to attach a first surface of the thin film integrated circuit over the first substrate to a second substrate;
rotating a first roller and a second roller to attach a second surface of the thin film integrated circuit over the first substrate to a third substrate;
sealing the thin film integrated circuit between the second substrate and the third substrate by performing at least one of a pressure treatment and a heat treatment while the thin film integrated circuit passes between the first roller and the second roller; and
rotating a receiving roller to wind the thin film integrated circuit which is sealed with the second substrate and the third substrate, wherein the first surface and the second surface are opposed to each other. - View Dependent Claims (78, 79, 80, 81)
-
Specification