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Substrate processing method, substrate processing system and storage medium

  • US 20080045030A1
  • Filed: 08/14/2007
  • Published: 02/21/2008
  • Est. Priority Date: 08/15/2006
  • Status: Abandoned Application
First Claim
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1. A substrate processing method including:

  • a step of conducting a step (a) of applying a plasma process using a processing gas containing fluorine to a silicon-containing film on a substrate, and a step (b) of applying a plasma process using a processing gas containing nitrogen and hydrogen to the substrate in one identical processing vessel, thereby forming an ammonium silicofluoride; and

    a step of subsequently heating the substrate at a temperature not less than a decomposition temperature of the ammonium silicofluoride in a processing vessel before placing the substrate in a clean room atmosphere.

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