NOVEL ASSEMBLY METHODS FOR MEDICAL ELECTRICAL LEADS

• US 20080046049A1
• Filed: 08/21/2006
• Published: 02/21/2008
• Est. Priority Date: 08/21/2006
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Skubitz, Sean P., Boatwright, Mary L., Bolea, Stephen L., Metzler, Michael E., Tower, Jessica L.
• Granted Patent: US 7,765,011 B2
• Time in Patent Office: Days
• US Class Current: 607/115
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0553 Paddle shaped electrodes, e.g. for laminotomy
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A method for making a medical electrical lead electrode assembly includes the steps of: forming an insulative carrier from an insulative material; coupling at least one conductive component to the carrier by inserting at least one tab of the at least one conductive component through the carrier, the tab extending away from an electrode portion of the component such that, after the tab is inserted, the electrode portion is disposed on a first side of the carrier and the tab is disposed on a second side of the carrier; coupling an elongate flexible conductor to the tab of the at least one component; and forming an insulative layer over the tab and the conductor on the second side of the carrier.

Claims

1. A method for making a medical electrical lead electrode assembly, the method comprising:

forming an insulative carrier from an insulative material, the carrier including a first side and a second side;

coupling at least one conductive component to the carrier by inserting at least one tab of the at least one conductive component through the carrier, the tab extending away from an electrode portion of the component such that, after the tab is inserted, the electrode portion is disposed on the first side of the carrier and the tab is disposed on the second side of the carrier;

coupling an elongate flexible conductor to the tab of the at least one component; and

forming an insulative layer over the tab and the conductor on the second side of the carrier.

2. The method of claim 1, wherein forming the carrier comprises a molding process.

3. The method of claim 1, wherein the carrier further includes a pre-formed opening and inserting the at least one tab through the carrier comprises inserting the tab through the opening.

4. The method of claim 1, further comprising:

forming a slit in a mesh panel; and

placing the mesh panel in a mold;

wherein forming the carrier comprises molding the insulative material over the mesh panel in the mold, the mold including features for forming at least one opening in the carrier, the opening corresponding to the slit in the mesh panel and through which the at least one tab is inserted.

5. The method of claim 1, further comprising bending the at least one tab toward a surface of the second side of the carrier.

6. The method of claim 5, wherein the surface of the second side of the carrier is opposite the electrode portion of the component on the first side of the carrier.

7. The method of claim 5, wherein the surface of the second side of the carrier is laterally offset from the electrode portion of the component on the first side of the carrier.

8. The method of claim 1, wherein coupling the conductor is performed prior to inserting the at least one tab.

9. The method of claim 1, further comprising disposing a portion of the conductor within a pre-formed channel of the carrier prior to forming the insulative layer.

10. The method of claim 9, wherein disposing the portion of the conductor is performed prior to coupling the conductor.

11. The method of claim 9, wherein disposing the portion of the conductor is performed after coupling the conductor.

12. The method of claim 1, wherein coupling the conductor to the tab of the at least one component comprises crimping.

13. The method of claim 1, wherein coupling the conductor to the tab of the at least one component comprises welding.

14. The method of claim 1, wherein the insulative layer is formed to further extend over the entirety of the second side of the carrier.

15. The method of claim 1, further comprising:

inserting the conductor with an insulative tube; and

coupling the tube to the carrier by forming the insulative layer, the insulative layer being formed to extend over the second side of the carrier and about the tube.

16. The method of claim 15, further comprising forming a bend in the tube prior to forming the insulative layer, the insulative layer being formed to extend about the bend of the tube.

17. The method of claim 15, further comprising perforating a sidewall of the tube to form an aperture therethrough, prior to forming the insulative layer, the insulative layer being formed to extend through the aperture.

18. The method of claim 1, further comprising:

placing the carrier, the at least one component coupled to the carrier and the conductor coupled to the tab of the component in a mold; and

wherein forming the insulative layer comprises molding the layer over the carrier the component and the conductor in the mold.

19. The method of claim 1, wherein the at least one tab comprises a pair of tabs and the conductor is coupled to one of the pair of tabs.

20. The method of claim 19, wherein the carrier further includes a pair of preformed openings and inserting the pair of tabs through the carrier comprises inserting a first tab of the pair of tabs through a first opening of the pair of openings and inserting a second tab of the pair of tabs through a second opening of the pair of openings.

21. The method of claim 19, further comprising bending each of the pair of tabs toward a surface of the second side of the carrier.

22. The method of claim 21, wherein the surface of the second side of the carrier is opposite the electrode portion of the at least one component on the first side of the carrier and each of the pair of tabs are bent toward one another.

23. The method of claim 21, wherein the surface of the second side of the carrier is laterally offset from the electrode portion of the at least one component on the first side of the carrier and each of the pair of tabs are bent away from one another.

24. The method of claim 1, wherein the at least one conductive component comprises a plurality of conductive components.