Pressure sensor and manufacturing method of the same

• US 20080047354A1
• Filed: 07/12/2007
• Published: 02/28/2008
• Est. Priority Date: 07/14/2006
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Ogawa, Tetsuya, Itoh, Osamu, Yoshino, Kazuhiro, Uchigashima, Hiroshi, Otsuka, Kiyoshi, Horiba, Keiji
• Granted Patent: US 7,559,247 B2
• Time in Patent Office: Days
• US Class Current: 73/767
• CPC Class Codes: G01L 19/0092 Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature G01L9/025, G01L9/045, G01L9/065, G01L9/085, G01L9/105, G01L9/125, G01L19/02, G01L19/04 take precedence; measuring two or more variable G01D21/02; temperature sensors with pressure compensation G01K1/26
• CPC Class Codes: G01L 19/143 Two part housings
• CPC Class Codes: G01L 9/0055 bonded on a diaphragm
• CPC Class Codes: G01L 9/06 of piezo-resistive devices

Abstract

A pressure sensor for detecting pressure includes: a metallic diaphragm for receiving the pressure; four strain gauges providing a Wheatstone bridge, wherein each strain gauge outputs an electric signal corresponding to deformation of the diaphragm when the diaphragm is deformed by the pressure; and four semiconductor chips corresponding to four strain gauges, wherein each strain gauge is disposed in the semiconductor chip. Each semiconductor chip is mounted on the diaphragm.

Claims

1. A pressure sensor for detecting pressure comprising:

a metallic diaphragm for receiving the pressure;

four strain gauges providing a Wheatstone bridge, wherein each strain gauge outputs an electric signal corresponding to deformation of the diaphragm when the diaphragm is deformed by the pressure; and

four semiconductor chips corresponding to four strain gauges, wherein each strain gauge is disposed in the semiconductor chip, wherein,

each semiconductor chip is mounted on the diaphragm.

7. The sensor according to claim 1, further comprising:

a bonding wire for coupling among the four strain gauges to provide the Wheatstone bridge.

8. The sensor according to claim 1, further comprising:

a bump for electrically coupling among the four strain gauges; and

a board having a wiring pattern, which corresponds to the bump, wherein

the four strain gauges are coupled with each other through the bump and the wiring pattern so that the four strain gauges provide the Wheatstone bridge.

9. The sensor according to claim 1, further comprising:

an aluminum wire disposed on both of the four semiconductor chips and the diaphragm, wherein

the four strain gauges are electrically coupled with each other through the aluminum wire so that the four strain gauges provide the Wheatstone bridge.

10. The sensor according to claim 1, wherein

each semiconductor chip has planar dimensions of a width in a range between 0.3 mm and 2.0 mm and a length in a range between 0.3 mm and 2.0 mm.

11. The sensor according to claim 1, wherein

the diaphragm includes a groove, which is disposed at a center portion of the diaphragm.

12. The sensor according to claim 11, wherein

the diaphragm has a pressure receiving surface for receiving the pressure, and

the groove protrudes from the pressure receiving surface.

13. The sensor according to claim 11, wherein

the diaphragm has a pressure receiving surface for receiving the pressure, and

the groove protrudes from a surface of the diaphragm opposite to the pressure receiving surface.

14. The sensor according to claim 1, wherein

the diaphragm includes a groove having a ring shape, which is disposed on a periphery portion of the diaphragm so that the groove surrounds the diaphragm.

15. The sensor according to claim 14, wherein

the diaphragm has a pressure receiving surface for receiving the pressure, and

the groove protrudes from the pressure receiving surface.

16. The sensor according to claim 14, wherein

the diaphragm has a pressure receiving surface for receiving the pressure, and

the groove protrudes from a surface of the diaphragm opposite to the pressure receiving surface.

17. The sensor according to claim 14, wherein

each semiconductor chip is disposed on an inside of the groove.

18. The sensor according to claim 1, further comprising:

a sensor element disposed at a center portion of the diaphragm, wherein

the sensor element is independently disposed from the four strain gauges.

19. The sensor according to claim 18, wherein

the sensor element contacts the center portion of the diaphragm.

20. The sensor according to claim 19, wherein

the sensor element is a temperature sensor for detecting a temperature of the diaphragm, or an acceleration sensor for detecting an acceleration of the diaphragm.

21. The sensor according to claim 18, wherein

the sensor element is separated from the center portion of the diaphragm,

the center portion of the diaphragm provides a mirror surface, and

the sensor element is a position sensor for detecting a displacement of the center portion of the diaphragm in such a manner that the sensor element emits a laser beam to the center portion.

22. The sensor according to claim 18, wherein

the diaphragm includes a groove, which is disposed at a center portion of the diaphragm,

the diaphragm has a pressure receiving surface for receiving the pressure,

the groove protrudes from the pressure receiving surface, and

the sensor element is disposed in the groove.

23. The sensor according to claim 1, wherein

each semiconductor chip is displaceable so that a relative position relationship among the four strain gauges is adjusted so as to control a sensitivity of the sensor.

24. The sensor according to claim 1, wherein

each semiconductor chip is mounted on the diaphragm in such a manner that a center portion of the diaphragm has a space for accommodating an additional member.

25. A method for manufacturing a pressure sensor according to claim 1, the method comprising:

arranging each semiconductor chip on a periphery portion of the diaphragm, which has a disk shape;

adjusting a sensor sensitivity of each semiconductor chip by sliding the semiconductor chip along with a radial direction of the diaphragm; and

bonding each semiconductor chip on the diaphragm after the adjusting.

26. The method according to claim 25, wherein

the arranging includes setting and mounting the four semiconductor chips on an integrated jig for increasing a positioning accuracy.

2. A pressure sensor for detecting pressure comprising:

a metallic diaphragm for receiving the pressure;

four strain gauges providing a Wheatstone bridge, wherein each strain gauge outputs an electric signal corresponding to deformation of the diaphragm when the diaphragm is deformed by the pressure;

a semiconductor chip, wherein a part of the four strain gauges is disposed in the semiconductor chip; and

a substrate having a signal processor for processing the electric signals outputted from the four strain gauges, wherein a rest part of the four strain gauges is disposed in the substrate, wherein

only the semiconductor chip is mounted on the diaphragm.

3. The sensor according to claim 2, wherein

the part of the four strain gauges includes one strain gauge or two strain gauges, and

the rest part of the four strain gauges includes two or three strain gauges.

4. A pressure sensor for detecting pressure comprising:

a metallic diaphragm for receiving the pressure;

four strain gauges providing a Wheatstone bridge, wherein each strain gauge outputs an electric signal corresponding to deformation of the diaphragm when the diaphragm is deformed by the pressure;

a first semiconductor chip, wherein two of the four strain gauges are disposed in the first semiconductor chip; and

a second semiconductor chip, wherein other two of the four strain gauges are disposed in the second semiconductor chip, wherein

the first and second semiconductor chips are mounted on the diaphragm.

5. A pressure sensor for detecting pressure comprising:

a metallic diaphragm for receiving the pressure;

four strain gauges providing a Wheatstone bridge, wherein each strain gauge outputs an electric signal corresponding to deformation of the diaphragm when the diaphragm is deformed by the pressure;

a first semiconductor chip, wherein one of the four strain gauges is disposed in the first semiconductor chip; and

a second semiconductor chip, wherein other three of the four strain gauges are disposed in the second semiconductor chip, wherein

the first and second semiconductor chips are mounted on the diaphragm.

6. A pressure sensor for detecting pressure comprising:

a metallic diaphragm for receiving the pressure;

four strain gauges providing a Wheatstone bridge, wherein each strain gauge outputs an electric signal corresponding to deformation of the diaphragm when the diaphragm is deformed by the pressure;

a first semiconductor chip, wherein two of the four strain gauges is disposed in the first semiconductor chip;

a second semiconductor chip, wherein another one of the four strain gauges is disposed in the second semiconductor chip; and

a third semiconductor chip, wherein a last one of the four strain gauges is disposed in the third semiconductor chip, wherein

the first to third semiconductor chips are mounted on the diaphragm.