Pressure sensor and manufacturing method of the same
First Claim
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1. A pressure sensor for detecting pressure comprising:
- a metallic diaphragm for receiving the pressure;
four strain gauges providing a Wheatstone bridge, wherein each strain gauge outputs an electric signal corresponding to deformation of the diaphragm when the diaphragm is deformed by the pressure; and
four semiconductor chips corresponding to four strain gauges, wherein each strain gauge is disposed in the semiconductor chip, wherein,each semiconductor chip is mounted on the diaphragm.
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Abstract
A pressure sensor for detecting pressure includes: a metallic diaphragm for receiving the pressure; four strain gauges providing a Wheatstone bridge, wherein each strain gauge outputs an electric signal corresponding to deformation of the diaphragm when the diaphragm is deformed by the pressure; and four semiconductor chips corresponding to four strain gauges, wherein each strain gauge is disposed in the semiconductor chip. Each semiconductor chip is mounted on the diaphragm.
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Citations
26 Claims
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1. A pressure sensor for detecting pressure comprising:
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a metallic diaphragm for receiving the pressure; four strain gauges providing a Wheatstone bridge, wherein each strain gauge outputs an electric signal corresponding to deformation of the diaphragm when the diaphragm is deformed by the pressure; and four semiconductor chips corresponding to four strain gauges, wherein each strain gauge is disposed in the semiconductor chip, wherein, each semiconductor chip is mounted on the diaphragm. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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2. A pressure sensor for detecting pressure comprising:
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a metallic diaphragm for receiving the pressure; four strain gauges providing a Wheatstone bridge, wherein each strain gauge outputs an electric signal corresponding to deformation of the diaphragm when the diaphragm is deformed by the pressure; a semiconductor chip, wherein a part of the four strain gauges is disposed in the semiconductor chip; and a substrate having a signal processor for processing the electric signals outputted from the four strain gauges, wherein a rest part of the four strain gauges is disposed in the substrate, wherein only the semiconductor chip is mounted on the diaphragm. - View Dependent Claims (3)
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4. A pressure sensor for detecting pressure comprising:
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a metallic diaphragm for receiving the pressure; four strain gauges providing a Wheatstone bridge, wherein each strain gauge outputs an electric signal corresponding to deformation of the diaphragm when the diaphragm is deformed by the pressure; a first semiconductor chip, wherein two of the four strain gauges are disposed in the first semiconductor chip; and a second semiconductor chip, wherein other two of the four strain gauges are disposed in the second semiconductor chip, wherein the first and second semiconductor chips are mounted on the diaphragm.
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5. A pressure sensor for detecting pressure comprising:
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a metallic diaphragm for receiving the pressure; four strain gauges providing a Wheatstone bridge, wherein each strain gauge outputs an electric signal corresponding to deformation of the diaphragm when the diaphragm is deformed by the pressure; a first semiconductor chip, wherein one of the four strain gauges is disposed in the first semiconductor chip; and a second semiconductor chip, wherein other three of the four strain gauges are disposed in the second semiconductor chip, wherein the first and second semiconductor chips are mounted on the diaphragm.
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6. A pressure sensor for detecting pressure comprising:
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a metallic diaphragm for receiving the pressure; four strain gauges providing a Wheatstone bridge, wherein each strain gauge outputs an electric signal corresponding to deformation of the diaphragm when the diaphragm is deformed by the pressure; a first semiconductor chip, wherein two of the four strain gauges is disposed in the first semiconductor chip; a second semiconductor chip, wherein another one of the four strain gauges is disposed in the second semiconductor chip; and a third semiconductor chip, wherein a last one of the four strain gauges is disposed in the third semiconductor chip, wherein the first to third semiconductor chips are mounted on the diaphragm.
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Specification