Wired circuit board

• US 20080047739A1
• Filed: 07/27/2007
• Published: 02/28/2008
• Est. Priority Date: 07/28/2006
• Status: Abandoned Application

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: Yokai, Takahiko, Ishii, Jun
• Application Number:
  US11/878,851
• Publication Number:
  US 20080047739A1
• Time in Patent Office: Days
• US Class Current: 174/255
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/0723 provided by an inner layer of PCB
• CPC Class Codes: H05K 3/108 by semi-additive methods; masks therefor characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241
• CPC Class Codes: H05K 3/181 by electroless plating adhesives therefor H05K3/387
• CPC Class Codes: H05K 3/388 by the use of a metallic or inorganic thin film adhesion layer
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602

Abstract

A wired circuit board has a metal supporting board, a first insulating layer formed on the metal supporting board, a first metal thin film formed on the first insulating layer, a metal foil formed on the first metal thin film, a second insulating layer formed on the first insulating layer to cover the metal foil, and a conductive pattern formed on the second insulating layer.

Claims

1. A wired circuit board comprising:

a metal supporting board;

a first insulating layer formed on the metal supporting board;

a first metal thin film formed on the first insulating layer;

a metal foil formed on the first metal thin film;

a second insulating layer formed on the first insulating layer to cover the metal foil; and

a conductive pattern formed on the second insulating layer.

2. The wired circuit board according to claim 1, further comprising:

a second metal thin film formed to be interposed between the metal foil and the second insulating layer.