HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF
3 Assignments
0 Petitions
Accused Products
Abstract
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
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Citations
539 Claims
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1-522. -522. (canceled)
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523. A space transformer comprising:
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a first substrate provided with first electrical contact locations on one side thereof;
first elongated electrical conductors, each having an elongate flexible shape and a respective first end connected to a respective first electrical contact location of said first electrical contact locations, and extending from the respective first electrical contact location;
a second substrate provided with second electrical contact locations on one side thereof and third electrical contact locations on an opposite side thereof;
the second contact locations facing the first contact locations and each first elongated electrical conductor having a respective second end connected to a respective one of the second electrical contact locations, the second substrate being disassembleable from the first substrate; and
second elongated electrical conductors, each having an elongate flexible shape and a respective first end connected to a respective third electrical contact location of said third electrical contact locations and extending from the respective third electrical contact location, selected ones of the first elongated electrical conductors are interconnected with selected ones of the second contact locations, and selected ones of the first contact locations are spaced from one another by first distances, and selected ones of the second elongated electrical conductors have second ends, remotely located from the first ends thereof which are spaced from one another by second distances. - View Dependent Claims (524, 525, 526, 527, 528, 529, 530, 531, 532, 533, 534, 535, 536, 537, 538)
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539-597. -597. (canceled)
Specification