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Tin phosphate barrier film, method, and apparatus

  • US 20080048178A1
  • Filed: 08/24/2006
  • Published: 02/28/2008
  • Est. Priority Date: 08/24/2006
  • Status: Abandoned Application
First Claim
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1. A method of inhibiting oxygen and moisture penetration of a device, comprising the steps of:

  • a. depositing a tin phosphate low liquidus temperature inorganic material on at least a portion of the device to create a deposited low liquidus temperature inorganic material; and

    b. heat treating the deposited low liquidus temperature inorganic material in a substantially oxygen and moisture free environment to form a hermetic seal;

    wherein the step of depositing the low liquidus temperature inorganic material comprises the use of a resistive heating element comprising tungsten.

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