Component and Process for Manufacturing the Same
First Claim
1. A process for manufacturing an electrical and/or optical component, the process comprising the following steps:
- etching at least one trench into a substrate;
laterally overgrowing the trench with at least one semiconductor layer and completely covering the trench with the semiconductor layer while forming a gas-filled, especially air-filled, cavity;
integrating an optoelectronic component into the semiconductor layer or in an additional semiconductor layer applied onto the semiconductor layer; and
placing an active region of the component above the cavity.
2 Assignments
0 Petitions
Accused Products
Abstract
An electrical and/or optical component and a process for manufacturing the component achieve especially good quality in the component and especially reliably avoid crystal dislocations in material layers of the component. In the process for producing a component, at least one trench is etched into a substrate, the trench is overgrown laterally by at least one semiconductor layer in such a way that the trench is completely covered by the semiconductor layer while forming a gas-filled, especially air-filled, cavity, and the component is integrated in the semiconductor layer or in a further semiconductor layer applied to the semiconductor layer, with an active region of the component being placed above the cavity.
52 Citations
25 Claims
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1. A process for manufacturing an electrical and/or optical component, the process comprising the following steps:
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etching at least one trench into a substrate;
laterally overgrowing the trench with at least one semiconductor layer and completely covering the trench with the semiconductor layer while forming a gas-filled, especially air-filled, cavity;
integrating an optoelectronic component into the semiconductor layer or in an additional semiconductor layer applied onto the semiconductor layer; and
placing an active region of the component above the cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. An electrical and/or optical component, comprising:
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a substrate having at least one trench;
at least one semiconductor layer laterally overgrown on said trench, completely covering said trench and forming a gas-filled, especially air-filled, cavity; and
an active region integrated into said semiconductor layer or a further semiconductor layer applied to said semiconductor layer, said active region disposed above said cavity. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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20. A process for manufacturing a component, the process comprising the following steps:
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etching at least one trench into a substrate;
after etching the trench, providing the substrate with a passivation layer by depositing the passivation layer to completely cover all lateral wall areas of the etched trench with the passivation layer;
depositing at least one semiconductor layer directly or indirectly onto the passivation layer, and laterally overgrowing the trench with the semiconductor layer to completely cover the trench with the semiconductor layer while forming a gas-filled, especially air-filled cavity; and
integrating the component in the semiconductor layer or in a further semiconductor layer applied to the semiconductor layer. - View Dependent Claims (21, 22, 23)
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24. A process for manufacturing a component, the process comprising the following steps:
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etching at least one trench into a substrate;
overgrowing the substrate laterally with at least one GaN semiconductor layer or a semiconductor layer containing GaN to completely cover the trench with the semiconductor layer while forming a gas-filled, especially air-filled, cavity;
interrupting the growth of the semiconductor layer on the substrate at least once and growing a respective intermediate layer with each interruption; and
integrating the component in the semiconductor layer or in a further semiconductor layer applied to the semiconductor layer. - View Dependent Claims (25)
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Specification