HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

• US 20080048690A1
• Filed: 10/30/2007
• Published: 02/28/2008
• Est. Priority Date: 10/19/1992
• Status: Abandoned Application

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Shih, Da-Yuan, Fogel, Keith, Norcott, Maurice, Walker, George, Lauro, Paul, Beaman, Brian
• Application Number:
  US11/929,873
• Publication Number:
  US 20080048690A1
• Time in Patent Office: Days
• US Class Current: 324/754
• CPC Class Codes: G01R 1/06744 Microprobes, i.e. having dimensions as IC details
• CPC Class Codes: G01R 1/0675 Needle-like
• CPC Class Codes: G01R 1/07307 with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
• CPC Class Codes: G01R 1/0735 arranged on a flexible frame or film
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips

Abstract

The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

Claims

1-402. -402. (canceled)

403. An assembly comprising:

an electric component;

said electronic component comprising a substrate;

said substrate has a surface;

a plurality of contact locations at said surface;

a fanout member;

said fanout member comprises an electrical conductor comprising a contact location end and a fanout location end;

said contact location end is electrically connected to at least one of said plurality of contact locations at said surface;

said fanout location end is displace relative to said at least one of said plurality of contact locations;

an elongated electrical conductor comprising a first end and a second end;

said first end of said elongated electrical conductor is electrically connected to said fanout location end;

said second end of said elongated electrical conductor is not adjacent said electronic component;

said elongated electrical conductor is free standing; and

said elongated electrical conductor is compliant and can be displaced so that said second end thereof moves in relation to the first end of said elongated electrical conductor.

404-597. -597. (canceled)