PRINTED CIRCUIT BOARD HAVING SUPPORTING PATTERNS

• US 20080049402A1
• Filed: 07/09/2007
• Published: 02/28/2008
• Est. Priority Date: 07/13/2006
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: HAN, Jun-Soo, KIM, Gil-Beag, JUNG, Yong-Jin
• Application Number:
  US11/775,148
• Publication Number:
  US 20080049402A1
• Time in Patent Office: Days
• US Class Current: 361/748
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/4824 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3511 Warping
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Abstract

A printed circuit board having supporting patterns is provided. The printed circuit board includes a base substrate having a circuit region and peripheral regions. The circuit region includes a plurality of unit cells arranged in a matrix, and the peripheral regions are located around the circuit region. Wires are located on the circuit region. First supporting bars are located on the peripheral regions and extend across the peripheral regions, and a plurality of supporting ribs traverse the first supporting bars.

Claims

1. A printed circuit board comprising:

a base substrate including a circuit region and peripheral regions located around the circuit region;

a first supporting bar formed on the base substrate within one of the peripheral regions, the first supporting bar extending along a length of the one of the peripheral regions; and

a plurality of first supporting ribs within the one of the peripheral regions, wherein at least one of the plurality of first supporting ribs traverses the first supporting bar.

2. The printed circuit board of claim 1, wherein the base substrate includes a top surface and a bottom surface opposite the top surface and wherein the first supporting bar and the plurality of first supporting ribs are formed on the top surface, the printed circuit board further comprising:

a second supporting bar formed on the bottom surface within the one of the peripheral regions.

3. The printed circuit board of claim 2, wherein a location of the second supporting bar on the bottom surface substantially corresponds to a location of the first supporting bar on the top surface.

4. The printed circuit board of claim 2, further comprising a plurality of second supporting ribs on the bottom surface within the one of the peripheral regions, wherein at least one of the plurality of second supporting ribs traverses the second supporting bar.

5. The printed circuit board of claim 4, wherein a width of at least one of the plurality of first supporting ribs is different from a width of at least one of the plurality of second supporting ribs.

6. The printed circuit board of claim 4, wherein a location of at least one of the plurality of second supporting ribs on the bottom surface substantially corresponds to a location of a region between adjacent ones of the plurality of first supporting ribs on the top surface.

7. The printed circuit board of claim 1, wherein:

the circuit region comprises;

an upper part;

a lower part opposite the upper part;

a left part between the upper and lower parts; and

a right part opposite the left part;

the peripheral regions comprise;

an upper peripheral region adjacent to the upper part;

a lower peripheral region adjacent to the lower part;

a left peripheral region adjacent to the left part; and

a right peripheral region adjacent to the right part;

a length of the upper peripheral region is greater than a length of at least one of the left and right peripheral regions along the left and right parts; and

the first supporting bar is formed on the base substrate in the upper peripheral region.

8. The printed circuit board of claim 7, further comprising a plurality of first supporting bars, wherein one of the plurality of first supporting bars is formed on the base substrate in the lower peripheral region.

9. The printed circuit board of claim 8, wherein a length of the lower peripheral region along the lower part is greater than the length of at least one of the left and right peripheral regions along the left and right parts.

10. The printed circuit board of claim 7, wherein the base substrate includes a top surface and a bottom surface opposite the top surface and wherein the first supporting bar and the plurality of first supporting ribs are formed on the top surface, the printed circuit board further comprising:

a second supporting bar formed on the bottom surface in the upper peripheral region.

11. The printed circuit board of claim 10, wherein a location of the second supporting bar on the bottom surface substantially corresponds to a location of the first supporting bar on the top surface.

12. The printed circuit board of claim 10, further comprising a plurality of second supporting ribs on the bottom surface within the upper peripheral region, wherein at least one of the plurality of second supporting ribs traverses the second supporting bar.

13. The printed circuit board of claim 12, wherein a width of at least one of the plurality of first supporting ribs is different from a width of at least one of the plurality of second supporting ribs.

14. The printed circuit board of claim 12, wherein a location of at least one of the plurality of second supporting ribs on the bottom surface substantially corresponds to a location of a region between adjacent ones of the plurality of first supporting ribs on the top surface.

15. The printed circuit board of claim 7, further comprising an auxiliary supporting bar formed on the base substrate in at least one of the left and right peripheral regions, wherein the auxiliary supporting bar is substantially parallel to the first supporting bar.

16. The printed circuit board of claim 1, further comprising:

a wire formed on the circuit region; and

a solder resist formed on the wire, the solder resist including an opening defined therethrough that exposes a portion of the wire,

wherein at least one of the first supporting bar and one or more of the plurality of first supporting ribs comprises substantially the same material as the wire.

17. The printed circuit board of claim 16, wherein the solder resist is formed on at least one of the first supporting bar and one or more of the plurality of first supporting ribs.

18. A printed circuit board comprising:

a base substrate having a top surface, a bottom surface opposite the top surface, a circuit region having an upper part, a lower part opposite the upper part, a left part between the upper and lower parts and a right part opposite the left part, and peripheral regions located around a periphery of the circuit region and including an upper peripheral region adjacent to the upper part, a lower peripheral region adjacent to the lower part, a left peripheral region adjacent to the left part and a right peripheral region adjacent to the right part, wherein a length of the upper peripheral region along the upper part is greater than a length of at least one of the left and right peripheral regions along the left and right parts;

a first supporting bar disposed on the top surface in the upper peripheral region and extending along the length of the upper peripheral region;

a plurality of first supporting ribs on the top surface within the upper peripheral region, wherein at least one of the plurality of first supporting ribs traverses the first supporting bar;

a second supporting bar disposed on the bottom surface in the upper peripheral region, wherein a location of the second supporting bar on the bottom surface in the upper peripheral region substantially corresponds to a location of the first supporting bar on the top surface in the upper peripheral region;

a plurality of second supporting ribs on the bottom surface within the upper peripheral region, wherein at least one of the plurality of second supporting ribs traverses the second supporting bar; and

an auxiliary supporting bar disposed on the base substrate in at least one of the left and right peripheral regions, wherein the auxiliary supporting bar is substantially parallel to at least one of the first and second supporting bars.

19. The printed circuit board of claim 18, wherein a length of the lower peripheral region along the lower part of the circuit region is greater than the length of at least one of the left and right peripheral regions along the left and right parts, the printed circuit board further comprising:

a plurality of first supporting bars and a plurality of second supporting bars,

wherein one of the plurality of first supporting bars is disposed on the top surface in the lower peripheral region, and

wherein one of the plurality of second supporting bars is disposed on the bottom surface in the lower peripheral region.

20. The printed circuit board of claim 18, wherein a width of at least one of the plurality of first supporting ribs is different from a width of at least one of the plurality of second supporting ribs.

21. The printed circuit board of claim 18, wherein a location of at least one of the plurality of second supporting ribs on the bottom surface substantially corresponds to a region between adjacent ones of the plurality of first supporting ribs on the top surface.

22. The printed circuit board of claim 18, further comprising:

a wire disposed on the circuit region; and

a solder resist disposed on the wire, the solder resist including an opening defined therethrough that exposes a portion of the wire,

wherein at least one of the first supporting bar and one or more of the plurality of first supporting ribs comprises substantially the same material as the wire.

23. The printed circuit board of claim 22, wherein the solder resist is disposed on at least one of the first supporting bar and one or more of the plurality of first supporting ribs.