Method for Manufacturing Display Device

• US 20080050851A1
• Filed: 08/16/2007
• Published: 02/28/2008
• Est. Priority Date: 08/24/2006
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: ARAI, Yasuyuki, Tanaka, Koichiro
• Granted Patent: US 7,727,847 B2
• Time in Patent Office: Days
• US Class Current: 438/29
• CPC Class Codes: H01L 21/76802 by forming openings in dielectrics
• CPC Class Codes: H01L 27/124 with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits wiring structures per se H01L23/52
• CPC Class Codes: H01L 27/1288 employing particular masking sequences or specially adapted masks, e.g. half-tone mask
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05B 33/10 Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
• CPC Class Codes: H10K 50/865 comprising light absorbing layers, e.g. light-blocking layers
• CPC Class Codes: H10K 59/131 Interconnections, e.g. wiring lines or terminals
• CPC Class Codes: H10K 59/8792 comprising light absorbing layers, e.g. black layers

Abstract

A light-absorbing layer is selectively formed over an insulating surface, an insulating layer is formed over the insulating surface and the light-absorbing layer, the insulating surface, the light-absorbing layer, and the insulating layer are irradiated with laser light to selectively remove only the insulating layer above the light-absorbing layer in an irradiated region of the insulating layer so that an opening reaching the light-absorbing layer is formed in the insulating layer, and a conductive film is formed in the opening so as to be in contact with the light-absorbing layer. By forming the conductive film in the opening so as to be in contact with the exposed light-absorbing layer, the conductive film can be electrically connected to the light-absorbing layer with the insulating layer interposed therebetween.

Claims

1. A method for manufacturing a display device, comprising the steps of:

forming a light-absorbing layer selectively over an insulating surface;

forming an insulating layer over the insulating surface and the light-absorbing layer;

irradiating the insulating surface, the light-absorbing layer, and the insulating layer with laser light to selectively remove the insulating layer above the light-absorbing layer so that an opening reaching the light-absorbing layer is formed in the insulating layer; and

forming a conductive film in the opening so as to be in contact with the light-absorbing layer.

5. The method for manufacturing the display device according to any one of claims 1 to 4, wherein the light-absorbing layer is formed of a conductive material.

6. The method for manufacturing the display device according to claim 5, wherein the light-absorbing layer comprises a material selected from the group consisting of chromium, tantalum, silver, molybdenum, nickel, titanium, cobalt, copper, aluminum, and a combination thereof

7. The method for manufacturing the display device according to any one of claims 1 to 4, wherein the light-absorbing layer is formed of a semiconductor material.

8. The method for manufacturing the display device according to claim 7, wherein the light-absorbing layer is formed of silicon.

9. The method for manufacturing the display device according to any one of claims 1 to 4, wherein the opening is formed by the laser light with a wavelength which is transmitted through the insulating layer.

2. A method for manufacturing a display device, comprising the steps of:

forming a conductive layer selectively over an insulating surface;

forming a light-absorbing layer over the conductive layer;

forming an insulating layer over the insulating surface and the light-absorbing layer;

irradiating the insulating surface, the light-absorbing layer, and the insulating layer with laser light to selectively remove the insulating layer above the light-absorbing layer so that an opening reaching the light-absorbing layer is formed in the insulating layer; and

forming a conductive film in the opening so as to be in contact with the light-absorbing layer.

3. A method for manufacturing a display device, comprising the steps of:

forming a conductive layer selectively over an insulating surface;

forming a light-absorbing layer over the conductive layer;

forming an insulating layer over the insulating surface and the light-absorbing layer;

irradiating the insulating surface, the light-absorbing layer, and the insulating layer with laser light to selectively remove the light-absorbing layer in an irradiated region with the laser light and the insulating layer above the light-absorbing layer so that an opening reaching the light-absorbing layer and the conductive layer is formed in the insulating layer; and

forming a conductive film in the opening so as to be in contact with the light-absorbing layer and the conductive layer.

4. A method for manufacturing a display device, comprising the steps of:

forming a plurality of light-absorbing layers over an insulating surface;

forming an insulating layer over the insulating surface and the plurality of light-absorbing layers;

irradiating the insulating surface, the plurality of light-absorbing layers, and the insulating layer with laser light to selectively remove the insulating layer above the plurality of light-absorbing layers so that a plurality of openings is formed in the insulating layer; and

forming a conductive film in the plurality of openings so as to be in contact with the plurality of light-absorbing layers.