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SEMICONDUCTOR STRUCTURES WITH BODY CONTACTS AND FABRICATION METHODS THEREOF

  • US 20080050873A1
  • Filed: 10/30/2007
  • Published: 02/28/2008
  • Est. Priority Date: 08/31/2005
  • Status: Active Grant
First Claim
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1. A method for forming a semiconductor structure in a semiconductor wafer including a semiconductor substrate, a semiconductor layer with a plurality of semiconductor bodies, and a buried dielectric layer separating the semiconductor substrate from the semiconductor layer, the method comprising:

  • building a plurality of vertical memory cells each in a corresponding one of a plurality of trenches in the semiconductor wafer;

    forming a via extending through one of the semiconductor bodies and the buried dielectric layer and extending into the semiconductor substrate; and

    at least partially filling the via with a plug of an electrically conductive material that extends through the buried dielectric layer to define a body contact having a first end electrically connected with the semiconductor body and a second end electrically connected with the semiconductor substrate.

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