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Hybrid sensor module and sensing method using the same

  • US 20080052931A1
  • Filed: 09/06/2007
  • Published: 03/06/2008
  • Est. Priority Date: 09/06/2006
  • Status: Active Grant
First Claim
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1. A hybrid sensor module comprising:

  • first and second sensors that are attached on one surface of a printed circuit board (PCB) so as to detect two-axis signal components parallel to the PCB;

    a third sensor that is attached on one surface of the PCB such that the axial direction of the third sensor is tilted at a predetermined angle from a vertical direction of the PCB, the third sensor detecting a signal component sensed in the axial direction; and

    a signal correction unit that is connected to the first to third sensor and corrects signal components, detected from the respective sensors, into signal components of an orthogonal coordinate system.

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