Light emitting device packages, light emitting diode (LED) packages and related methods

• US 20080054286A1
• Filed: 08/27/2007
• Published: 03/06/2008
• Est. Priority Date: 01/27/2005
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Andrews, Peter, Medendorp, Nicholas, Loh, Ban
• Granted Patent: US 7,939,842 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48471 the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

Light emitting device packages, light emitting diode (LED) packages and related methods are disclosed. According to one aspect, a light emitting device package is provided. The package includes a mounting pad adapted for attachment of a light emitting device. A lens coupler is attached to the mounting pad and defines an opening for containing the light emitting device and a quantity of encapsulant. The lens coupler includes a surface defining a depression which comprises at least one edge that shapes an outer surface of the encapsulant.

Claims

1. A light emitting device package comprising:

a mounting pad adapted for attachment of a light emitting device;

a lens coupler attached to the mounting pad and defining an opening for containing the light emitting device and a quantity of encapsulant, and wherein the lens coupler includes a surface defining a depression which comprises at least one edge that shapes an outer surface of the encapsulant; and

a lens including a surface that substantially conforms to the shaped outer surface of the encapsulant.

2. The light emitting device package of claim 1 wherein the light emitting device includes a light emitting diode (LED).

3. The light emitting device package of claim 1 wherein the lens coupler comprises one or more reflective surfaces positioned for reflecting light generated by the light emitting device.

7. The light emitting device package of claim 1 wherein the encapsulant is a first encapsulant and comprises a first convex meniscus, and further wherein the surface of the lens coupler includes first and second depressions substantially surrounding an open end of the opening, the first depression forming the at least one edge and being positioned between the second depression and the open end of the opening, and the second depression shapes a second convex meniscus of a second encapsulant.

9. The light emitting device package of claim 7 wherein the second encapsulant is disposed on the first encapsulant.

10. The light emitting device package of claim 9 wherein the lens adheres to the second encapsulant.

11. The light emitting device package of claim 7 wherein the second depression is in a raised position with respect to the first depression.

12. The light emitting device package of claim 11 wherein the first and second depressions are positioned on first and second portions of the surface, the second portion being in a raised position with respect to the first portion.

14. The light emitting device package of claim 1 wherein the surface of the lens is concave.

19. The light emitting device package of claim 1 comprising a substrate attached to the mounting pad, and wherein the depression is a first depression, and wherein the lens coupler comprises a second depression formed in an underside surface of the lens coupler to enclose encapsulant for adhering the lens coupler to the substrate.

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20. A method of forming a light emitting device package, the method comprising:

providing a mounting pad adapted for attachment of a light emitting device;

attaching a lens coupler to the mounting pad, the lens coupler defining an opening for containing the light emitting device, wherein the lens coupler includes a surface defining a depression which comprises at least one edge;

depositing encapsulant in the opening such that the at least one edge of the surface shapes an outer surface of the encapsulant; and

positioning a lens to substantially enclose the opening and to interface with the encapsulant, wherein the lens includes surface that substantially conforms to the shaped outer surface of the encapsulant.

22. The method of claim 20 wherein the lens coupler comprises one or more reflective surfaces positioned for reflecting light generated by the light emitting device.

26. The method of claim 20 wherein the encapsulant is a first encapsulant and comprises a first convex meniscus, and further wherein the surface of the lens coupler includes first and second depressions substantially surrounding an open end of the opening, the first depression forming the at least one edge and being positioned between the second depression and the open end of the opening, and

the method comprising:

at least partially curing the first encapsulant; and

depositing a second encapsulant on the first encapsulant such that the second depression shapes the second encapsulant to have a second convex meniscus.

28. The method of claim 26 wherein the lens adheres to the second encapsulant.

29. The method of claim 26 wherein the second depression is in a raised position with respect to the first depression.

30. The method of claim 29 wherein the first and second depressions are positioned on first and second portions of the surface, the second portion being in a raised position with respect to the first portion.

32. The method of claim 20 wherein the surface of the lens is concave.

37. The method of claim 20 comprising a substrate attached to the mounting pad, and wherein the depression is a first depression, and wherein the lens coupler comprises a second depression formed in an underside surface of the lens coupler to enclose encapsulant for adhering the lens coupler to the substrate.

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38. A light emitting diode (LED) package comprising:

a substrate including a mounting pad;

an LED attached to the mounting pad;

a lens coupler attached to the mounting pad and defining an opening for containing the LED and a first quantity of encapsulant, wherein the lens coupler includes at least one surface defining a first depression which comprises a first edge that shapes an outer surface of the first quantity of encapsulant, and wherein the at least one surface defines a second depression which comprises a second edge that substantially surrounds the first edge and that shapes an outer surface of a second quantity of encapsulant, wherein the first quantity of encapsulant is positioned between the LED and the second quantity of encapsulant; and

a lens positioned to substantially enclose the opening and to interface with the first and second encapsulants, wherein the lens includes surface that substantially conforms to the shaped outer surface of the first quantity of encapsulant.

39. The LED package of claim 38 wherein the lens coupler comprises one or more reflective surfaces positioned for reflecting light generated by the light emitting device.

42. The LED package of claim 38 wherein the first depression is positioned between the second depression and the open end of the opening.

43. The LED package of claim 42 wherein the first and second depressions each substantially surround the open end of the opening.

49. The LED package of claim 38 wherein the surface of the lens is concave.

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53. A method of forming a light emitting diode (LED) package, the method comprising:

providing a substrate including a mounting pad;

attaching an LED to the mounting pad;

attaching a lens coupler to the mounting pad, the lens coupler defining an opening for containing the LED, wherein the lens coupler includes at least one surface defining a first depression which comprises a first edge, and wherein the at least one surface defines a second depression which comprises a second edge that substantially surrounds the first edge;

depositing a first quantity of encapsulant in the opening such that the first edge of the surface shapes an outer surface of the first quantity of encapsulant;

depositing a second quantity of encapsulant on the first quantity of encapsulant such that the second edge of the surface shapes an outer surface of the second quantity of encapsulant, wherein the first quantity of encapsulant is positioned between the LED and the second quantity of encapsulant; and

positioning a lens to substantially enclose the opening and to interface with the second quantity of encapsulant, wherein the lens includes surface that substantially conforms to the shaped outer surface of the first quantity of encapsulant.

63. The method of claim 53 wherein the surface of the lens is concave.

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