POWER MODULE WITH LAMINAR INTERCONNECT
First Claim
1. A power module comprising:
- at least one substrate comprising an upper layer, an electrical insulator and a thermal coupling layer, wherein said upper layer comprises at least one electrically conductive pattern and is configured for receiving at least one power device, wherein said electrical insulator is disposed between said upper layer and said thermal coupling layer, and wherein said thermal coupling layer is configured for thermal coupling to a base plate;
at least one laminar interconnect comprising a first electrically conductive layer, an insulating layer and a second electrically conductive layer, wherein said insulating layer is disposed between said first and second electrically conductive layers, wherein said first electrically conductive layer of said laminar interconnect is electrically connected to said upper layer of said substrate; and
a plurality of electrical connections connecting a top side of the at least one power device to said second electrically conductive layer of said laminar interconnect.
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Abstract
A power module includes a substrate that includes an upper layer, an electrical insulator and a thermal coupling layer. The upper layer includes an electrically conductive pattern and is configured for receiving power devices. The electrical insulator is disposed between the upper layer and the thermal coupling layer. The thermal coupling layer is configured for thermal coupling to a heat sink. The power module further includes at least one laminar interconnect that includes first and second electrically conductive layers and an insulating layer disposed between the first and second electrically conductive layers. The first electrically conductive layer of the laminar interconnect is electrically connected to the upper layer of the substrate. Electrical connections connect a top side of the power devices to the second electrically conductive layer of the laminar interconnect.
51 Citations
20 Claims
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1. A power module comprising:
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at least one substrate comprising an upper layer, an electrical insulator and a thermal coupling layer, wherein said upper layer comprises at least one electrically conductive pattern and is configured for receiving at least one power device, wherein said electrical insulator is disposed between said upper layer and said thermal coupling layer, and wherein said thermal coupling layer is configured for thermal coupling to a base plate;
at least one laminar interconnect comprising a first electrically conductive layer, an insulating layer and a second electrically conductive layer, wherein said insulating layer is disposed between said first and second electrically conductive layers, wherein said first electrically conductive layer of said laminar interconnect is electrically connected to said upper layer of said substrate; and
a plurality of electrical connections connecting a top side of the at least one power device to said second electrically conductive layer of said laminar interconnect. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20-46. -46. (canceled)
Specification