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PRESSURE SENSOR

  • US 20080054383A1
  • Filed: 09/01/2006
  • Published: 03/06/2008
  • Est. Priority Date: 09/01/2006
  • Status: Active Grant
First Claim
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1. A differential pressure sensor comprising:

  • a micro-electromechanical sensor die fabricated as a plurality of sensor die sites on a semiconductor wafer, and then singularized, the sensor die having a top face surface including die electrical output pads exposed to a first test fluid source and a bottom side surface exposed to a second test fluid source; and

    a sensor die support member having a die support member fluid access port with a support member port perimeter;

    wherein one of the top face surface or the bottom side surface is sealed fully around the support member port perimeter by a first wafer scale seal formed on the plurality of sensor die sites before die singulation.

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