APPARATUS AND METHOD FOR PACKAGING CIRCUITS
First Claim
1. A circuit module, comprising:
- a support structure having a plurality of conductors;
at least one mount located on the support structure that is communicatively coupled to the plurality of conductors;
an integrated circuit die coupled to the mount, the integrated circuit die comprising;
a main body including a top layer, a bottom layer, and a peripheral surface extending between the top layer and the bottom layer;
a bond pad on the main body;
an edge contact embedded in the peripheral surface configured to be communicatively coupled to corresponding contacts in the mount; and
a line connecting the bond pad to the edge contact.
1 Assignment
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Accused Products
Abstract
Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.
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Citations
20 Claims
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1. A circuit module, comprising:
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a support structure having a plurality of conductors;
at least one mount located on the support structure that is communicatively coupled to the plurality of conductors;
an integrated circuit die coupled to the mount, the integrated circuit die comprising;
a main body including a top layer, a bottom layer, and a peripheral surface extending between the top layer and the bottom layer;
a bond pad on the main body;
an edge contact embedded in the peripheral surface configured to be communicatively coupled to corresponding contacts in the mount; and
a line connecting the bond pad to the edge contact. - View Dependent Claims (2, 3, 4, 5)
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6. A circuit module, comprising:
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a support having a plurality of mounts positioned on the support, each of the mounts communicatively coupled to a plurality of leads extending outwardly from the mounts and configured to provide bidirectional communications between the mounts and external circuits;
an integrated circuit die coupled to the mount, the integrated circuit die comprising;
a main body including a first layer, an opposing second layer, and a peripheral surface extending between the first layer and the second layer;
a bond pad positioned on the main body;
an edge contact embedded in the peripheral surface and configured to communicatively couple to a selected lead; and
a line coupling the bond pad to the edge contact. - View Dependent Claims (7, 8, 9, 10)
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11. A module, comprising:
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at least one mount communicatively coupled to a plurality of leads extending outwardly from the mounts and configured to provide bidirectional communications between the mounts and external circuits;
an integrated circuit die coupled to the mount, the integrated circuit die comprising;
a main body including a first layer, an opposing second layer, and a peripheral surface extending between the first layer and the second layer;
a bond pad disposed on the main body;
an edge contact disposed on the peripheral surface configured to communicatively couple to a selected lead; and
a line coupling the bond pad to the edge contact. - View Dependent Claims (12, 13, 14)
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15. An electrical module including a plurality of mounting locations operatively coupled to leads extending outwardly from the mounting locations, comprising:
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a plurality of integrated circuit dies coupled to corresponding mounts, each of the integrated circuit dies having a main body that includes a first layer, an opposing second layer, and a peripheral surface extending between the first layer and the second layer;
a bond pad positioned on the main body;
an edge contact positioned on the peripheral surface that is configured to be communicatively coupled to a selected lead; and
a line coupling the bond pad to the edge contact. - View Dependent Claims (16, 17)
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18. An electrical module including a plurality of mounting locations positioned on a supporting substrate and operatively coupled to leads extending outwardly from the mounting locations, comprising:
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a plurality of integrated circuit dies coupled to corresponding mounts, each of the integrated circuit dies having a main body that includes a first layer, an opposing second layer, and a peripheral surface extending between the first layer and the second layer;
a bond pad positioned on the main body;
an edge contact positioned on the peripheral surface that is configured to be communicatively coupled to a selected lead; and
a line coupling the bond pad to the edge contact. - View Dependent Claims (19, 20)
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Specification