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Power electronic package having two substrates with multiple electronic components

  • US 20080054425A1
  • Filed: 08/29/2006
  • Published: 03/06/2008
  • Est. Priority Date: 08/29/2006
  • Status: Active Grant
First Claim
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1. A power electronic package comprising:

  • first and second high thermal conductivity insulating non-planar substrates; and

    a plurality of electronic components mounted on each of the first and second high thermal conductivity insulating non-planar substrates, whereinthe first and second high thermal conductivity insulating non-planar substrates are coupled each other at a plurality of bonding regions so that mechanical separation between the first and second high thermal conductivity insulating non-planar substrates is controlled by the number of the bonding regions, an arrangement of the bonding regions, a shape of each bonding region, and a material of the bonding regions, andthe mechanical separation provides a net axially-directed compressive force in the electronic components.

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