Power electronic package having two substrates with multiple electronic components
First Claim
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1. A power electronic package comprising:
- first and second high thermal conductivity insulating non-planar substrates; and
a plurality of electronic components mounted on each of the first and second high thermal conductivity insulating non-planar substrates, whereinthe first and second high thermal conductivity insulating non-planar substrates are coupled each other at a plurality of bonding regions so that mechanical separation between the first and second high thermal conductivity insulating non-planar substrates is controlled by the number of the bonding regions, an arrangement of the bonding regions, a shape of each bonding region, and a material of the bonding regions, andthe mechanical separation provides a net axially-directed compressive force in the electronic components.
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Abstract
A power electronic package includes: first and second high thermal conductivity insulating non-planar substrates; and a plurality of electronic components mounted on each of the substrates. The substrates are coupled each other at a plurality of bonding regions so that mechanical separation between the substrates is controlled by the number of the bonding regions, an arrangement of the bonding regions, a shape of each bonding region, and a material of the bonding regions. The mechanical separation provides a net axially-directed compressive force in the electronic components.
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Citations
34 Claims
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1. A power electronic package comprising:
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first and second high thermal conductivity insulating non-planar substrates; and a plurality of electronic components mounted on each of the first and second high thermal conductivity insulating non-planar substrates, wherein the first and second high thermal conductivity insulating non-planar substrates are coupled each other at a plurality of bonding regions so that mechanical separation between the first and second high thermal conductivity insulating non-planar substrates is controlled by the number of the bonding regions, an arrangement of the bonding regions, a shape of each bonding region, and a material of the bonding regions, and the mechanical separation provides a net axially-directed compressive force in the electronic components. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
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Specification