STRUCTURE OF WAFER LEVEL PACKAGE WITH AREA BUMP
First Claim
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1. A package structure, comprising:
- at least a chip, comprising an active surface and a plurality of bonding pads on the active surface;
a passivation layer covering the active surface of the chip and exposing the bonding pads;
a redistribution layer on the passivation layer and over the bonding pads of the chip, wherein the redistribution layer comprises at least a dielectric layer and a patterned metal layer, wherein the patterned metal layer comprises a plurality of first bumping pads and at least a second bumping pad, and the patterned metal layer is electrically connected to the bonding pads;
a plurality of first bumps, respectively connected to the first bumping pads; and
at least a second bump, connected to the second bumping pad, wherein a size of the second bumping pad is larger than a size of one of the first bumping pads.
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Abstract
A package structure with an area bump has at least a chip (also known as a die), a redistribution layer, a plurality of first bumps (normal bumps) and at least a second bump (area bump). The redistribution layer may reroute and integrate the bonding pads of the chip and incorporate the passive components therein.
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Citations
19 Claims
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1. A package structure, comprising:
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at least a chip, comprising an active surface and a plurality of bonding pads on the active surface;
a passivation layer covering the active surface of the chip and exposing the bonding pads;
a redistribution layer on the passivation layer and over the bonding pads of the chip, wherein the redistribution layer comprises at least a dielectric layer and a patterned metal layer, wherein the patterned metal layer comprises a plurality of first bumping pads and at least a second bumping pad, and the patterned metal layer is electrically connected to the bonding pads;
a plurality of first bumps, respectively connected to the first bumping pads; and
at least a second bump, connected to the second bumping pad, wherein a size of the second bumping pad is larger than a size of one of the first bumping pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification