Method of manufacturing a stamper

• US 20080054518A1
• Filed: 08/29/2007
• Published: 03/06/2008
• Est. Priority Date: 08/31/2006
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: LEE, Jung-Woo, LEE, Hyuk-Soo, KWAK, Jeong-Bok, HONG, Myeong-Ho, RA, Seung-Hyun
• Application Number:
  US11/896,103
• Publication Number:
  US 20080054518A1
• Time in Patent Office: Days
• US Class Current: 264/227
• CPC Class Codes: B29C 33/3878 used as masters for making successive impressions
• CPC Class Codes: H05K 2203/0108 Male die used for patterning, punching or transferring
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding

Abstract

A method of manufacturing a stamper is disclosed. By using a method that includes: manufacturing a small stamper, in which a first relievo is formed; repeatedly imprinting the small stamper on a large master mold to form a first intaglio corresponding to the first relievo; and molding such that a second relievo is formed, which is in correspondence with the first intaglio, a broad stamper having identical repeated patterns may be manufactured.

Claims

1. A method of manufacturing a stamper, the method comprising:

manufacturing a small stamper having a first relievo formed therein;

repeatedly imprinting the small stamper on a large master mold to form a first intaglio corresponding to the first relievo; and

molding such that a second relievo is formed, the second relievo being in correspondence with the first intaglio.

2. The method of claim 1, wherein manufacturing the small stamper comprises:

removing a portion of a small master mold to form a second intaglio; and

molding such that the first relievo is formed in correspondence with the second intaglio.

3. The method of claim 2, wherein molding such that the first relievo is formed comprises:

molding an inside of the second intaglio by any one of nickel electroforming and polymer molding; and

removing the small master mold to manufacture the small stamper having the first relievo formed therein.

4. The method of claim 1, wherein molding such that the second relievo is formed comprises:

filling an inside of the first intaglio by any one of nickel electroforming and polymer filling; and

removing the large master mold to manufacture a broad stamper having the second relievo formed therein.