Semiconductor device
First Claim
1. A semiconductor device comprising:
- a signal processing circuit;
a first antenna and a second antenna which are electrically connected to the signal processing circuit; and
a storage device for supplying electric power to the signal processing circuit,wherein the first antenna is configured to receive a signal by an electromagnetic induction method or an electromagnetic coupling method;
wherein the second antenna is configured to receive a signal by a microwave method;
wherein the signal processing circuit is configured to receive and transmit information via the first antenna,wherein the signal processing circuit is configured to receive and transmit information via the second antenna; and
wherein the signal processing circuit is configured to generate a direct current voltage from the signals received by the first antenna and the second antenna and the storage device is charged up by the direct current voltage.
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Accused Products
Abstract
The semiconductor device includes a signal processing circuit, an antenna circuit that is connected to the signal processing circuit, and a storage means that supplies electric power to the signal processing circuit. The signal processing circuit receives and transmits information through the antenna circuit, generates a direct current voltage from signals received by the antenna circuit, and stores the direct current voltage in the storage means. Furthermore, the antenna circuit has an antenna portion that receives signals by an electromagnetic induction method and an antenna portion that receives signals by a microwave method so that signals of frequencies from a wide band can be received. Because signals from a wide band can be received, the environment in which the storage means can be charged is widened.
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Citations
16 Claims
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1. A semiconductor device comprising:
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a signal processing circuit; a first antenna and a second antenna which are electrically connected to the signal processing circuit; and a storage device for supplying electric power to the signal processing circuit, wherein the first antenna is configured to receive a signal by an electromagnetic induction method or an electromagnetic coupling method; wherein the second antenna is configured to receive a signal by a microwave method; wherein the signal processing circuit is configured to receive and transmit information via the first antenna, wherein the signal processing circuit is configured to receive and transmit information via the second antenna; and wherein the signal processing circuit is configured to generate a direct current voltage from the signals received by the first antenna and the second antenna and the storage device is charged up by the direct current voltage. - View Dependent Claims (5, 9, 13)
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2. A semiconductor device comprising:
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a signal processing circuit; a first antenna and a second antenna which are electrically connected to the signal processing circuit; and a storage device for supplying electric power to the signal processing circuit, wherein the first antenna comprises a coil-shaped conductor; wherein the second antenna comprises a pair of linear conductors; wherein the signal processing circuit is configured to receive and transmit information via the first antenna, wherein the signal processing circuit is configured to receive and transmit information via the second antenna; and wherein the signal processing circuit is configured to generate a direct current voltage from signals received by the first antenna and the second antenna and the storage device is charged up by the direct current voltage. - View Dependent Claims (6, 10, 14)
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3. A semiconductor device comprising:
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a signal processing circuit comprising a power section and a logic section; a first antenna and a second antenna which are electrically connected to the power section and the logic section; a storage device for supplying electric power to the signal processing circuit, wherein the logic section is configured to receive and transmit information via the first antenna, wherein the logic section is configured to receive and transmit information via the second antenna; and wherein the power section is configured to generate a direct current voltage from signals received by the first antenna and the second antenna and the storage device is charged up by the direct current voltage. - View Dependent Claims (7, 11, 15)
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4. A semiconductor device comprising:
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a signal processing circuit comprising a power section and a logic section; a first antenna and a second antenna which are electrically connected to the power section and the logic section; a storage device for supplying electric power to the signal processing circuit, wherein the logic section is configured to receive and transmit information via the first antenna; wherein the logic section is configured to receive and transmit information via the second antenna; wherein the power section generates a direct current voltage from signals received by the first antenna and the second antenna and the storage device is charged up by the direct current voltage; wherein a frequency of a signal received by the first antenna and a frequency of a signal received by the second antenna are different. - View Dependent Claims (8, 12, 16)
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Specification