ASSEMBLED STRUCTURE OF LARGE-SIZED LED LAMP
First Claim
1. An assembled structure of a large-sized LED lamp, comprising:
- a substrate (1);
a plurality of LED modules (2) fixed on one surface of the substrate (1), each LED modules (2) comprising a circuit board (21) and a plurality of LEDs (22) fixedly connected to the circuit board (21);
a lamp mask (3) mounted on the surface of the substrate (1) provided with the LED modules (2) so as to cover the LED modules (2);
a plurality of heat-dissipating modules (5) fixedly provided on the other surface of the substrate (1), each heat-dissipating module (5) provided to correspond to each LED module (2); and
a lamp cover (6) mounted on the surface of the substrate (1) provided with the heat-dissipating modules (5) so as to cover the heat-dissipating modules (5),wherein each heat-dissipating module (5) comprises a plurality of heat-dissipating fins (51) arranged at identical intervals, two U-shaped heat pipes (52) penetrating through the heat-dissipating fins (51), andwherein a hole is formed on each heat-dissipation fin (51) so as to make a tunnel formed in the heat-dissipating module (5), and both elongated ends of each U-shaped heat pipe (52) are embedded in the heat-dissipating fins (51) to respectively locate above and beneath the tunnel while a lower elongated end of the U-shaped heat pipe (52) has a flat surface exposed out and leveled with a lower surface of the heat-dissipating module (%) so that when the heat-sissipating module (5) is fixed, the flat surface together with the lower surface are directly contacted on the surface of the substrate (1) provided with the heating-dissipating modules.
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Accused Products
Abstract
An assembled structure of a large-sized LED lamp includes a substrate. One surface of the substrate is provided with a plurality of LED modules. Each LED module comprises a circuit board and a plurality of LEDs fixedly connected to the circuit board. A lamp mask is locked onto the substrate to cover and protect the LED modules. A sealing material is provided between the lamp mask and the substrate to protect the permeation of liquid. Further, at the positions of the other surface of the substrate, heat-dissipating modules are provided to correspond to each LED module, respectively. The heat-dissipating modules are used to dissipate heat generated from the LEDs. A lamp cover is covered to the exterior of the heat-dissipating modules. The lamp cover is locked onto the substrate. With the modulization of each constituent element, the detachment, assembly and repair of the present invention can be much simpler and more convenient.
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Citations
9 Claims
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1. An assembled structure of a large-sized LED lamp, comprising:
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a substrate (1); a plurality of LED modules (2) fixed on one surface of the substrate (1), each LED modules (2) comprising a circuit board (21) and a plurality of LEDs (22) fixedly connected to the circuit board (21); a lamp mask (3) mounted on the surface of the substrate (1) provided with the LED modules (2) so as to cover the LED modules (2); a plurality of heat-dissipating modules (5) fixedly provided on the other surface of the substrate (1), each heat-dissipating module (5) provided to correspond to each LED module (2); and a lamp cover (6) mounted on the surface of the substrate (1) provided with the heat-dissipating modules (5) so as to cover the heat-dissipating modules (5), wherein each heat-dissipating module (5) comprises a plurality of heat-dissipating fins (51) arranged at identical intervals, two U-shaped heat pipes (52) penetrating through the heat-dissipating fins (51), and wherein a hole is formed on each heat-dissipation fin (51) so as to make a tunnel formed in the heat-dissipating module (5), and both elongated ends of each U-shaped heat pipe (52) are embedded in the heat-dissipating fins (51) to respectively locate above and beneath the tunnel while a lower elongated end of the U-shaped heat pipe (52) has a flat surface exposed out and leveled with a lower surface of the heat-dissipating module (%) so that when the heat-sissipating module (5) is fixed, the flat surface together with the lower surface are directly contacted on the surface of the substrate (1) provided with the heating-dissipating modules. - View Dependent Claims (2, 3, 4, 5, 6, 8, 9)
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7. (canceled)
Specification