METHOD FOR INLINE DIE CUTTING THAT COMPENSATES FOR IMAGE VARIANCES

• US 20080060535A1
• Filed: 09/07/2007
• Published: 03/13/2008
• Est. Priority Date: 09/08/2006
• Status: Abandoned Application

• Current Assignee: Electronics For Imaging Incorporated
• Original Assignee: Electronics For Imaging Incorporated
• Inventors: Edwards, Paul, Hennessy, John, Bruck, Frank
• Application Number:
  US11/851,900
• Publication Number:
  US 20080060535A1
• Time in Patent Office: Days
• US Class Current: 101/32
• CPC Class Codes: B26D 5/34 scanning being effected by a photosensitive device
• CPC Class Codes: B26F 1/384 using rotating drums

Abstract

A method of inline die cutting of a substrate including providing a substrate having a print image thereon; detecting a position of the print image and outputting a web position signal; computing a die correction signal in response to the web position signal and outputting the die correction signal; and adjusting the position of a die in response to the die correction signal to ensure cutting of the substrate at a predetermined location.

Claims

1. A method of inline die cutting of a substrate, the method comprising:

providing a substrate having a print image thereon;

detecting a position of the print image and outputting a web position signal;

computing a die correction signal in response to the web position signal and outputting the die correction signal; and

adjusting the position of a die in response to the die correction signal to ensure cutting of the substrate at a predetermined location.

2. The method according to claim 1 wherein the providing a substrate having a print image thereof comprising:

providing a substrate; and

printing the print image upon the substrate through non-contact printing.

3. The method according to claim 2 wherein the printing the print image upon the substrate through non-contact printing comprises printing the print image upon the substrate through non-contact printing using ink jet printing.

4. The method according to claim 1 wherein the providing a substrate having a print image thereof comprising:

providing a substrate; and

printing the print image upon the substrate having registration indicia.

5. The method according to claim 4 wherein the detecting a position of the print image and outputting a web position signal comprises detecting the position of the print image by detecting the registration indicia and outputting the web position signal.

6. The method according to claim 4 wherein the registration indicia comprises at least one of image features of the print image and high contrast portions of the print image.

7. The method according to claim 1, further comprising:

detecting a position of the die and outputting a die position signal; and

wherein the computing the die correction signal in response to the web position signal and outputting the die correction signal comprises computing the die correction signal in response to the web position signal and the die position signal and outputting the die correction signal.

8. The method according to claim 1 wherein the adjusting the position of the die in response to the die correction signal to ensure cutting of the substrate at the predetermined location comprises at least one of rotating, aligning, adjusting, advancing, and retarding the die.

9. A method of inline die cutting of a substrate, the method comprising:

providing a substrate;

printing a print image upon the substrate through non-contact printing;

detecting a position of the print image and outputting a web position signal;

detecting a position of a die and outputting a die position signal;

computing a die correction signal in response to the web position signal and the die position signal and outputting a die correction signal; and

adjusting the position of the die in response to the die correction signal to ensure cutting of the substrate at a predetermined location.

10. The method according to claim 9 wherein the printing the print image upon the substrate through non-contact printing comprises printing the print image upon the substrate through non-contact printing using ink jet printing.

11. The method according to claim 9 wherein the printing the print image upon the substrate through non-contact printing comprises printing the print image having registration indicia upon the substrate through non-contact printing.

12. The method according to claim 11 wherein the detecting a position of the print image and outputting a web position signal comprises detecting the position of the print image by detecting the registration indicia and outputting the web position signal.

13. The method according to claim 11 wherein the registration indicia comprises at least one of image features of the print image and high contrast portions of the print image.

14. The method according to claim 9 wherein the adjusting the position of the die in response to the die correction signal to ensure cutting of the substrate at the predetermined location comprises at least one of rotating, aligning, adjusting, advancing, and retarding the die.