COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
First Claim
1. A method of fabricating a complementary metal-oxide-semiconductor device, comprising:
- providing a substrate having an isolation structure dividing the substrate into a first active region and a second active region, wherein the first active region has a first gate structure, a first spacer structure and a first LDD formed therein and the second active region has a second gate structure, a second spacer structure and a second LDD formed therein;
forming a passivation layer conformally over the substrate, wherein the passivation layer comprises a carbon-containing oxynitride layer;
forming a photoresist layer on the passivation layer of the second active region;
performing an etching process by using the photoresist layer as a mask to remain a portion of the passivation layer on the first gate structure and the first spacer structure;
removing the photoresist layer;
removing a portion of the exposed substrate in the first active region by using the passivation layer as a mask to form a trench in the substrate;
filling an epitaxial material layer in the trench to serve as a first conductive source/drain (S/D) region;
removing the passivation layer; and
forming a doped region on the substrate in the second active region to serve as a second conductive S/D region.
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Accused Products
Abstract
A complementary metal-oxide-semiconductor (CMOS) device includes a substrate with a first active region and a second active region; a first gate structure and a second gate structure, respectively disposed on the first active region and the second active region; a first spacer structure and a second spacer structure respectively disposed on sidewalls of the first gate structure and the second gate structure; a first LDD and a second LDD respectively disposed in the substrate at both sides of the first gate structure and the second gate structure; an epitaxial material layer, disposed in the first active region and located on a side of the first LDD; and a passivation layer, disposed on the first gate structure, the first spacer structure, and the first LDD and covering the second active region, wherein the passivation layer comprises a carbon-containing oxynitride layer.
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Citations
31 Claims
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1. A method of fabricating a complementary metal-oxide-semiconductor device, comprising:
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providing a substrate having an isolation structure dividing the substrate into a first active region and a second active region, wherein the first active region has a first gate structure, a first spacer structure and a first LDD formed therein and the second active region has a second gate structure, a second spacer structure and a second LDD formed therein; forming a passivation layer conformally over the substrate, wherein the passivation layer comprises a carbon-containing oxynitride layer; forming a photoresist layer on the passivation layer of the second active region; performing an etching process by using the photoresist layer as a mask to remain a portion of the passivation layer on the first gate structure and the first spacer structure; removing the photoresist layer; removing a portion of the exposed substrate in the first active region by using the passivation layer as a mask to form a trench in the substrate; filling an epitaxial material layer in the trench to serve as a first conductive source/drain (S/D) region; removing the passivation layer; and forming a doped region on the substrate in the second active region to serve as a second conductive S/D region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of fabricating a complementary metal-oxide-semiconductor device, comprising:
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providing a substrate having an isolation structure dividing the substrate into a first active region and a second active region, wherein the first active region has a first gate structure, a first spacer structure and a first LDD formed therein and the second active region has a second gate structure, a second spacer structure and a second LDD formed therein; forming a first passivation layer to conformally cover the substrate, wherein the first passivation layer is a carbon-containing oxynitride layer; forming a first photoresist layer on the substrate to cover the first passivation layer on the second active region; performing an etching process by using the first photoresist layer as a mask to remain a portion of the first passivation layer on the first gate structure and the first spacer structure; removing the first photoresist layer; removing a part of the exposed substrate in the first active region by using the first passivation layer as a mask to form a first trench in the substrate; filling a first epitaxial material layer in the first trench to serve as a first conductive S/D region; removing the first passivation layer; forming a second passivation layer to conformally cover the substrate, wherein the second passivation layer is a carbon-containing oxynitride layer; forming a second photoresist layer on the substrate to cover the second passivation layer on the first active region; performing an etching process by using the second photoresist layer as a mask to remain a portion of the second passivation layer on the second gate structure and the second spacer structure; removing the second photoresist layer; removing a portion of the exposed substrate in the second active region by using the second passivation layer as a mask to form a second trench in the substrate; and filling a second epitaxial material layer in the first trench to serve as a second conductive S/D region. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A complementary metal-oxide-semiconductor device, comprising:
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a substrate having an isolation structure dividing the substrate into a first active region and a second active region; a first gate structure, disposed on the substrate in the first active region; a second gate structure, disposed on the substrate in the second active region; a first spacer structure, disposed on a sidewall of the first gate structure; a second spacer structure, disposed on a sidewall of the second gate structure; a first LDD, disposed in the substrate at both sides of the first gate structure; a second LDD, disposed on the substrate at both sides of the second gate structure; an epitaxial material layer, disposed in the substrate in the first active region and located at a side of the first LDD to serve as a first conductive S/D region; and a passivation layer, disposed on the first gate structure, the first spacer structure, and the first LDD and covering the second active region, wherein the passivation layer is a carbon-containing oxynitride layer. - View Dependent Claims (25, 26, 27)
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28. A complementary metal-oxide-semiconductor device, comprising:
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a substrate having an isolation structure dividing the substrate into a first active region and a second active region; a first gate structure, disposed on the substrate in the first active region; a second gate structure, disposed on the substrate in the second active region; a first spacer structure, disposed on a sidewall of the first gate structure; a second spacer structure, disposed on a sidewall of the second gate structure; a first LDD, disposed in the substrate at both sides of the first gate structure; a second LDD, disposed on the substrate at both sides of the second gate structure; a first epitaxial material layer, disposed in the substrate in the first active region and located at a side of the first LDD, so as to serve as a first conductive S/D region; a second epitaxial material layer, disposed in the second active region and located at a side of the second LDD, so as to serve as a second conductive S/D region; and a passivation layer, disposed on the second gate structure, the second spacer structure, and the second LDD and covering the first active region, wherein the passivation layer is a carbon-containing oxynitride layer. - View Dependent Claims (29, 30, 31)
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Specification