Package for sealing an integrated circuit die
First Claim
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1. A semiconductor assembly comprising:
- a die having a substrate;
a mass suspended over the substrate with anchors and generally lying in a first plane, and movable along a first direction, the movable mass having one or more fingers extending along a second direction perpendicular to the first direction;
stationary plates, wherein movement of the movable fingers relative to the stationary plates causes a change in capacitance that is used to sense motion in at least one direction that is in the first plane; and
a cap bonded to the die, the cap surrounding the mass, the mass and the cap defining a space therebetween so that the cap does not contact the mass.
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Abstract
A die has a part that is sealed with a cap. The seal can be hermetic or non-hermetic. If hermetic, a layer of glass or metal is formed in the surface of the die, and the cap has a layer of glass or metal at a peripheral area so that, when heated, the layers form a hermetic seal. A non-hermetic seal can be formed by bonding a cap with a patterned adhesive. The cap, which can be silicon or can be a metal paddle, is electrically coupled to a fixed voltage to shield the part of the die.
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Citations
18 Claims
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1. A semiconductor assembly comprising:
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a die having a substrate;
a mass suspended over the substrate with anchors and generally lying in a first plane, and movable along a first direction, the movable mass having one or more fingers extending along a second direction perpendicular to the first direction;
stationary plates, wherein movement of the movable fingers relative to the stationary plates causes a change in capacitance that is used to sense motion in at least one direction that is in the first plane; and
a cap bonded to the die, the cap surrounding the mass, the mass and the cap defining a space therebetween so that the cap does not contact the mass. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. An apparatus comprising:
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a semiconductor die; and
a plastic package, the semiconductor die being molded in the plastic package;
wherein the semiconductor die is molded without a die paddle on a surface of the. - View Dependent Claims (16)
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17. A semiconductor assembly comprising:
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a die having a substrate;
a mass over at least a portion of the substrate with anchors and generally lying in a first plane, the mass being movable along a first direction and having a sensing element;
a stationary structure that is not movable relative to the substrate, wherein movement of the sensing element relative to the stationary structure causes a change in an electrical characteristic that is sensed to detect motion in at least one direction;
a cap hermetically bonded to the die to create a vacuum environment, the cap surrounding the mass, the mass and the cap defining a space therebetween so that the cap does not contact the mass; and
a plastic package encapsulating the die and the cap.
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18. A semiconductor assembly comprising:
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a die having a substrate, the substrate having a well;
a mass recessed in the well of the substrate, coupled to the substrate with anchors, generally lying in a first plane, and movable along a first direction relative to the substrate, the movable mass having one or more sensing elements;
a stationary structure, wherein movement of the sensing element relative to the stationary structure causes a change in an electrical characteristic that is detected to sense motion in at least one direction in the first plane; and
a cap bonded to the die, the cap surrounding the mass, the mass and the cap defining a space therebetween so that the cap does not contact the mass.
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Specification